20090722
18-21
A94H0EL
ELECTRICAL PARTS LIST
[42MD459B/F7 (Serial No. : DS1A**********)]
PRODUCT SAFETY NOTE:
Products marked with a
#
have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
BD MAIN CBA & BD MECHANISM
ASSEMBLY
DIGITAL MAIN CBA UNIT
JACK POWER CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Ref. No.
Description
Part No.
BD MAIN CBA & BD MECHANISM ASSEMBLY
N7KF0BUN
Ref. No.
Description
Part No.
DIGITAL MAIN CBA UNIT
A94H0MMA-001
Ref. No.
Description
Part No.
JACK POWER CBA
Consists of the following:
A94H0MJC-001
CAPACITORS
C101
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V
CHD1EK30B104
C104
CHIP CERAMIC CAP.(1608) CH J 47pF/50V
CHD1JJ3CH470
C105
ELECTROLYTIC CAP. 10
µ
F/50V M
CE1JMASDL100
C106
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C107
CHIP CERAMIC CAP.(1608) CH J 1000pF/50V
CHD1JJ3CH102
C108
CHIP CERAMIC CAP.(1608) CH J 47pF/50V
CHD1JJ3CH470
C109
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C110
ELECTROLYTIC CAP. 1000
µ
F/6.3V M
CE0KMASDL102
C111
CHIP CERAMIC CAP. CH J 220pF/50V
CHD1JJ3CH221
C201
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C202
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C203
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C204
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C205
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C206
ELECTROLYTIC CAP. 220
µ
F/6.3V M
CE0KMASDL221
C401
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C402
ELECTROLYTIC CAP. 47
µ
F/25V M
CE1EMASDL470
C403
ELECTROLYTIC CAP. 10
µ
F/50V M H7
CE1JMAVSL100
C404
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C405
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C406
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C407
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C410
CHIP CERAMIC CAP.(1608) B K 2.2
µ
F/10V
CHD1AK30B225
C411
CHIP CERAMIC CAP.(1608) B K 2.2
µ
F/10V
CHD1AK30B225
C412
ELECTROLYTIC CAP. 330
µ
F/16V M
CE1CMASDL331
C413
ELECTROLYTIC CAP. 330
µ
F/10V M
CE1AMASDL331
C503
CHIP CERAMIC CAP. F Z 0.01
µ
F/50V
CHD1JZ30F103
C601
METALIZED FILM CAP. 0.0033
µ
F/1.6KV J
CT3C332F7004
C602
CAP ELECTROLYTIC 100
µ
F/400V/M/22/25
CA2H101DYG17
C603
POLYESTER FILM CAP. (PB FREE) 0.047
µ
F/
100V J
CA2A473DT018
C604
CERAMIC CAP. RB 100pF/2KV
CA3D101TE006
C605
POLYESTER FILM CAP. (PB FREE) 0.001
µ
F/
100V J
CA2A102DT018
C606
POLYESTER FILM CAP. (PB FREE) 0.1
µ
F/100V
J
CA2A104DT018
C607
POLYESTER FILM CAP. (PB FREE) 0.0022
µ
F/
100V J
CA2A222DT018
C610
#
SAFTY CAP. 2200pF/250V KX
CA2E222MR101
C612
POLYESTER FILM CAP. (PB FREE) 0.0022
µ
F/
100V J
CA2A222DT018
C614
ELECTROLYTIC CAP 3300
µ
F/25V M
CE1EMZNDL332
C615
ELECTROLYTIC CAP 3300
µ
F/25V M
CE1EMZNDL332
C617
ELECTROLYTIC CAP. 220
µ
F/50V M
CE1JMASDL221
C618
ELECTROLYTIC CAP. 4700
µ
F/10V M P=7.5
CE1AMZNDL472
C619
ELECTROLYTIC CAP. 1000
µ
F/10V M
CE1AMASDL102
C620
CAP ALUMINUM ELECTOLYTIC 2200
µ
F/6.3V
M
CE0KMZNDL222
C621
ELECTROLYTIC CAP. 1000
µ
F/10V M
CE1AMASDL102
C622
ELECTROLYTIC CAP. 470
µ
F/25V M
CE1EMASDL471
C623
CAP CERAMIC (AX) 0.01
µ
F/50V/B/K
CA1J103TU061
C624
ELECTROLYTIC CAP. 470
µ
F/25V M
CE1EMASDL471
C625
ELECTROLYTIC CAP. 10
µ
F/50V M
CE1JMASDL100
C626
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASDL101
C628
ELECTROLYTIC CAP. 1000
µ
F/10V M
CE1AMASDL102
C629
ELECTROLYTIC CAP 3300
µ
F/6.3V M
CE0KMZNDL332
C630
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C631
ELECTROLYTIC CAP. 1
µ
F/50V M
CE1JMASDL1R0
C633
ELECTROLYTIC CAP. 330
µ
F/50V M
CE1JMZNDL331
C634
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
CHD1JZ30F104
C635
ELECTROLYTIC CAP. 100
µ
F/10V M
CE1AMASDL101
C636
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V
CHD1EZ30F104
C637
CHIP CERAMIC CAP.(2125) F Z 10
µ
F/10V
CHE1AZ30F106
C638
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V
CHD1EZ30F104
C639
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V
CHD1EZ30F104
C640
CHIP CERAMIC CAP.(1608) CH J 1000pF/50V
CHD1JJ3CH102
C641
CHIP CERAMIC CAP.(2125) F Z 10
µ
F/10V
CHE1AZ30F106
C642
CHIP CERAMIC CAP.(2125) F Z 10
µ
F/10V
CHE1AZ30F106
C643
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V
CHD1EZ30F104
C644
CHIP CERAMIC CAP.(1608) B K 5600pF/50V
CHD1JK30B562
C645
CHIP CERAMIC CAP.(2125) F Z 10
µ
F/10V
CHE1AZ30F106
C646
CHIP CERAMIC CAP.(2125) F Z 10
µ
F/10V
CHE1AZ30F106
C647
CHIP CERAMIC CAP.(1608) CH J 1000pF/50V
CHD1JJ3CH102
C648
CHIP CERAMIC CAP.(1608) CH J 1000pF/50V
CHD1JJ3CH102
C701
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C703
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C704
ELECTROLYTIC CAP. 10
µ
F/50V M H7
CE1JMAVSL100
C705
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C706
CHIP CERAMIC CAP.(1608) CH J 100pF/50V
CHD1JJ3CH101
C707
CHIP CERAMIC CAP. F Z 0.47
µ
F/16V
CHD1CZ30F474
C708
CHIP CERAMIC CAP.(1608) CH J 100pF/50V
CHD1JJ3CH101
C709
CHIP CERAMIC CAP. F Z 0.47
µ
F/16V
CHD1CZ30F474
Ref. No.
Description
Part No.
Summary of Contents for LD427SSX
Page 17: ...5 3 FL9 5 1DC 2 Rear Cabinet S 1 1 Stand Assembly S 3 S 2 S 3 S 3 S 3 S 4 S 5 Fig D1 ...
Page 62: ...11 4 FL9 5SCJP2 Jack Power 2 3 Schematic Diagram ...
Page 63: ...11 5 FL9 5SCJP3 Jack Power 3 3 Schematic Diagram ...
Page 67: ...11 9 BD Power Schematic Diagram FL9 5SCBDP ...
Page 68: ...11 10 FL9 5SCIR IR Sensor Junction Schematic Diagram ...
Page 69: ...11 11 FL9 5SCF Function Schematic Diagram ...
Page 70: ...11 12 SD Schematic Diagram FL9 5SCSD ...
Page 83: ...11 25 BD Main 8 11 Schematic Diagram FL9 5SCBD8 ...
Page 85: ...11 27 BD Main 10 11 Schematic Diagram FL9 5SCBD10 ...
Page 92: ...11 34 BA94H0F01042 A BD Power CBA Top View BD Power CBA Bottom View ...
Page 93: ...11 35 BA94H0F01042 B SD CBA Top View SD CBA Bottom View ...