Philips HTS3180, Service Manual

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temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in
so-called 'dry-packaging' (sealed pack
including a silica gel pack) to protect the IC
against moisture. After opening, dependent of
MSL-level seen on indicatorlabel in the bag,
the BGA-IC possibly still has to be
baked dry. This will be communicated via
AYS-website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005,
containing leaded soldering-tin and
components, all needed spare-parts will be
available till the end of the service-period. For
repair of such sets nothing changes.
On our website
www.atyourservice.ce.Philips.com you find
more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs
used in Philips-sets.
You will find this and more technical
information within the “magazine”, chapter
“workshop news”.
For additional questions please contact your
local repair-helpdesk.
How to Remove / Install Flat
Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering
Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue
to the CBA; when removing entire flat pack-IC,
first apply soldering iron to center of the flat
pack-IC and heat up. Then remove (glue will
be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by
models. Use an appropriate hot-air flat
pack-IC desoldering machine, whose shape
matches that of the Flat Pack-IC.
2. Do not supply hot air to the chip parts
around the flat pack-IC for over 6 seconds
because damage to the chip parts may occur.
Put masking tape around the flat pack-IC to
protect other parts from damage. (Fig. S-1-2)
3. The flat pack-IC on the CBA is affixed with
glue, so be careful not to break or damage the
foil of each pin or the solder lands under the IC
when removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder
from all pins of the flat pack-IC. When you use
solder flux which is applied to all pins of the flat
pack-IC, you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one
by one, using a sharp pin or wire to which
solder will not adhere (iron wire). When
heating the pins, use a fine tip soldering iron or
a hot air desoldering machine. (Fig. S-1-4)
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