Philips CBTD3306 Product Data Sheet Download Page 15

CBTD3306

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 8 — 1 May 2012 

15 of 17

NXP Semiconductors

CBTD3306

Dual bus switch with level shifting

17. Legal information

17.1 Data 

sheet 

status

 

[1]

Please consult the most recently issued document before initiating or completing a design. 

[2]

The term ‘short data sheet’ is explained in section “Definitions”. 

[3]

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status 
information is available on the Internet at URL

http://www.nxp.com

17.2 Definitions

Draft — 

The document is a draft version only. The content is still under 

internal review and subject to formal approval, which may result in 
modifications or additions. NXP Semiconductors does not give any 
representations or warranties as to the accuracy or completeness of 
information included herein and shall have no liability for the consequences of 
use of such information.

Short data sheet — 

A short data sheet is an extract from a full data sheet 

with the same product type number(s) and title. A short data sheet is intended 
for quick reference only and should not be relied upon to contain detailed and 
full information. For detailed and full information see the relevant full data 
sheet, which is available on request via the local NXP Semiconductors sales 
office. In case of any inconsistency or conflict with the short data sheet, the 
full data sheet shall prevail.

Product specification — 

The information and data provided in a Product 

data sheet shall define the specification of the product as agreed between 
NXP Semiconductors and its customer, unless NXP Semiconductors and 
customer have explicitly agreed otherwise in writing. In no event however, 
shall an agreement be valid in which the NXP Semiconductors product is 
deemed to offer functions and qualities beyond those described in the 
Product data sheet.

17.3 Disclaimers

Limited warranty and liability — 

Information in this document is believed to 

be accurate and reliable. However, NXP Semiconductors does not give any 
representations or warranties, expressed or implied, as to the accuracy or 
completeness of such information and shall have no liability for the 
consequences of use of such information. NXP Semiconductors takes no 
responsibility for the content in this document if provided by an information 
source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, 
punitive, special or consequential damages (including - without limitation - lost 
profits, lost savings, business interruption, costs related to the removal or 
replacement of any products or rework charges) whether or not such 
damages are based on tort (including negligence), warranty, breach of 
contract or any other legal theory. 

Notwithstanding any damages that customer might incur for any reason 
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards 
customer for the products described herein shall be limited in accordance 
with the 

Terms and conditions of commercial sale

 of NXP Semiconductors.

Right to make changes — 

NXP Semiconductors reserves the right to make 

changes to information published in this document, including without 
limitation specifications and product descriptions, at any time and without 
notice. This document supersedes and replaces all information supplied prior 
to the publication hereof.

Suitability for use — 

NXP Semiconductors products are not designed, 

authorized or warranted to be suitable for use in life support, life-critical or 
safety-critical systems or equipment, nor in applications where failure or 
malfunction of an NXP Semiconductors product can reasonably be expected 
to result in personal injury, death or severe property or environmental 
damage. NXP Semiconductors and its suppliers accept no liability for 
inclusion and/or use of NXP Semiconductors products in such equipment or 
applications and therefore such inclusion and/or use is at the customer’s own 
risk.

Applications — 

Applications that are described herein for any of these 

products are for illustrative purposes only. NXP Semiconductors makes no 
representation or warranty that such applications will be suitable for the 
specified use without further testing or modification. 

Customers are responsible for the design and operation of their applications 
and products using NXP Semiconductors products, and NXP Semiconductors 
accepts no liability for any assistance with applications or customer product 
design. It is customer’s sole responsibility to determine whether the NXP 
Semiconductors product is suitable and fit for the customer’s applications and 
products planned, as well as for the planned application and use of 
customer’s third party customer(s). Customers should provide appropriate 
design and operating safeguards to minimize the risks associated with their 
applications and products. 

NXP Semiconductors does not accept any liability related to any default, 
damage, costs or problem which is based on any weakness or default in the 
customer’s applications or products, or the application or use by customer’s 
third party customer(s). Customer is responsible for doing all necessary 
testing for the customer’s applications and products using NXP 
Semiconductors products in order to avoid a default of the applications and 
the products or of the application or use by customer’s third party 
customer(s). NXP does not accept any liability in this respect.

Limiting values — 

Stress above one or more limiting values (as defined in 

the Absolute Maximum Ratings System of IEC 60134) will cause permanent 
damage to the device. Limiting values are stress ratings only and (proper) 
operation of the device at these or any other conditions above those given in 
the Recommended operating conditions section (if present) or the 
Characteristics sections of this document is not warranted. Constant or 
repeated exposure to limiting values will permanently and irreversibly affect 
the quality and reliability of the device.

Terms and conditions of commercial sale — 

NXP Semiconductors 

products are sold subject to the general terms and conditions of commercial 
sale, as published at 

http://www.nxp.com/profile/terms

, unless otherwise 

agreed in a valid written individual agreement. In case an individual 
agreement is concluded only the terms and conditions of the respective 
agreement shall apply. NXP Semiconductors hereby expressly objects to 
applying the customer’s general terms and conditions with regard to the 
purchase of NXP Semiconductors products by customer.

No offer to sell or license — 

Nothing in this document may be interpreted or 

construed as an offer to sell products that is open for acceptance or the grant, 
conveyance or implication of any license under any copyrights, patents or 
other industrial or intellectual property rights.

Document status

[1][2]

Product status

[3]

Definition

Objective [short] data sheet

Development

This document contains data from the objective specification for product development. 

Preliminary [short] data sheet

Qualification

This document contains data from the preliminary specification. 

Product [short] data sheet

Production

This document contains the product specification. 

Summary of Contents for CBTD3306

Page 1: ... CDM JESD22 C101E exceeds 1000 V 3 Ordering information 4 Marking CBTD3306 Dual bus switch with level shifting Rev 8 1 May 2012 Product data sheet Table 1 Ordering information Type number Package Name Description Version CBTD3306D SO8 plastic small outline package 8 leads body width 3 9 mm SOT96 1 CBTD3306PW TSSOP8 plastic thin shrink small outline package 8 leads body width 4 4 mm SOT530 1 CBTD33...

Page 2: ...2B 002aab985 2OE 2A 2 1 5 7 3 6 Fig 2 Pin configuration for SO8 SOT96 1 Fig 3 Pin configuration for TSSOP8 SOT530 1 CBTD3306 1OE VCC 1A 2OE 1B 2B GND 2A 001aak832 1 2 3 4 6 5 8 7 CBTD3306 1OE VCC 1A 2OE 1B 2B GND 2A 001aak833 1 2 3 4 6 5 8 7 Fig 4 Pin configuration SOT833 1 XSON8 Fig 5 Pin configuration SOT902 2 XQFN8 CBTD3306 2B 2OE VCC 2A 1B 1A 1OE GND 001aal404 3 6 2 7 1 8 4 5 Transparent top v...

Page 3: ...ratings are observed 9 Recommended operating conditions Table 3 Pin description Symbol Pin Description 1OE 2OE 1 7 output enable input 1A 2A 2 5 data input output A port 1B 2B 3 6 data input output B port GND 4 ground 0 V VCC 8 positive supply voltage Table 4 Function selection 1 Input Input output nOE nA nB L nA nB H Z Table 5 Limiting values In accordance with the Absolute Maximum Rating System ...

Page 4: ...west voltage of the two nA or nB terminals Table 7 Static characteristics Voltages are referenced to GND ground 0 V Symbol Parameter Conditions Tamb 40 C to 85 C Unit Min Typ 1 Max VIK input clamping voltage VCC 4 5 V II 18 mA 1 2 V II input leakage current VCC 5 5 V VI GND or 5 5 V 1 μA ICC supply current VCC 5 5 V ISW 0 mA VI VCC or GND 1 5 mA Vpass pass voltage see Figure 6 to Figure 10 V ΔICC ...

Page 5: ...s supply voltage Tamb 85 C typical Fig 7 Pass voltage versus supply voltage Tamb 70 C typical 001aak834 VCC V 4 4 5 6 5 2 4 8 2 8 2 4 3 2 3 6 Vpass V 2 0 4 3 1 2 001aak835 VCC V 4 4 5 6 5 2 4 8 2 8 2 4 3 2 3 6 Vpass V 2 0 4 1 2 3 1 ISW 100 μA 2 ISW 6 mA 3 ISW 12 mA 4 ISW 24 mA 1 ISW 100 μA 2 ISW 6 mA 3 ISW 12 mA 4 ISW 24 mA Fig 8 Pass voltage versus supply voltage Tamb 25 C typical Fig 9 Pass volt...

Page 6: ... rights reserved Product data sheet Rev 8 1 May 2012 6 of 17 NXP Semiconductors CBTD3306 Dual bus switch with level shifting 1 ISW 100 μA 2 ISW 6 mA 3 ISW 12 mA 4 ISW 24 mA Fig 10 Pass voltage versus supply voltage Tamb 40 C typical 001aak838 VCC V 4 4 5 6 5 2 4 8 2 8 2 4 3 2 3 6 Vpass V 2 0 1 3 2 4 ...

Page 7: ...PZH tdis is the same as tPLZ and tPHZ 12 Waveforms Table 8 Dynamic characteristics Voltages are referenced to GND ground 0 V For test circuit see Figure 13 Symbol Parameter Conditions Tamb 40 C to 85 C Unit Min Typ Max tpd propagation delay nA nB to nB nA see Figure 11 1 2 0 25 ns VCC 5 0 V 0 5 V ten enable time nOE to nA or nB see Figure 12 2 1 0 5 4 ns VCC 5 0 V 0 5 V tdis disable time nOE to nA...

Page 8: ...Table 9 Logic levels VOL and VOH are typical output voltage levels that occur with the output load Fig 12 Enable and disable times 001aak298 tPLZ tPHZ outputs disabled outputs enabled VY VX outputs enabled output LOW to OFF OFF to LOW output HIGH to OFF OFF to HIGH nOE input VI 3 5 V VM VM VOL VOH GND GND tPZL tPZH VM VM Table 9 Measurement points Supply voltage Input Output VCC VI VM VM VX VY VCC...

Page 9: ...ith one transition per measurement Definitions for test circuit RL Load resistance CL Load capacitance including jig and probe capacitance RT Termination resistance should be equal to output impedance Zo of the pulse generator VEXT External voltage for measuring switching times Fig 13 Test circuit for measuring switching times VM VM tW tW 10 90 0 V VI VI negative pulse positive pulse 0 V VM VM 90 ...

Page 10: ...0 3 8 1 27 6 2 5 8 1 05 0 7 0 6 0 7 0 3 8 0 o o 0 25 0 1 0 25 DIMENSIONS inch dimensions are derived from the original mm dimensions Notes 1 Plastic or metal protrusions of 0 15 mm 0 006 inch maximum per side are not included 2 Plastic or metal protrusions of 0 25 mm 0 01 inch maximum per side are not included 1 0 0 4 SOT96 1 X w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L v M A A 3 A 4 5 pin 1 in...

Page 11: ...ION ISSUE DATE IEC JEDEC JEITA mm 0 15 0 05 0 95 0 85 0 30 0 19 0 20 0 13 3 1 2 9 4 5 4 3 0 65 6 5 6 3 0 70 0 35 8 0 0 1 0 1 0 1 0 94 DIMENSIONS mm are the original dimensions Notes 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included 2 Plastic or metal protrusions of 0 25 mm maximum per side are not included 0 7 0 5 SOT530 1 MO 153 00 02 24 03 02 18 w M bp D Z e 0 25 1 4 8 ...

Page 12: ...OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT833 1 MO 252 SOT833 1 07 11 14 07 12 07 DIMENSIONS mm are the original dimensions XSON8 plastic extremely thin small outline package no leads 8 terminals body 1 x 1 95 x 0 5 mm D E e1 e A1 b L L1 e1 e1 0 1 2 mm scale Notes 1 Including plating thickness 2 Can be visible in some manufacturing processes UNIT mm 0 25 0 17 2 0 1 9 0 35 0...

Page 13: ... sot902 2_po 10 11 02 11 03 31 Unit 1 mm max nom min 0 5 0 05 0 00 1 65 1 60 1 55 1 65 1 60 1 55 0 55 0 5 0 15 0 10 0 05 0 1 0 05 A Dimensions Note 1 Plastic or metal protrusions of 0 075 mm maximum per side are not included XQFN8 plastic extremely thin quad flat package no leads 8 terminals body 1 6 x 1 6 x 0 5 mm SOT902 2 A1 b 0 25 0 20 0 15 D E e e1 L 0 35 0 30 0 25 L1 v w 0 05 y y1 0 05 0 1 2 ...

Page 14: ...12 Revision history Document ID Release date Data sheet status Change notice Supersedes CBTD3306 v 8 20120501 Product data sheet CBTD3306 v 7 Modifications For type number CBTD3306GM the SOT code has changed to SOT902 2 CBTD3306 v 7 20120103 Product data sheet CBTD3306 v 6 Modifications Marking code for type number CBTD3306D changed CBTD3306 v 6 20111121 Product data sheet CBTD3306 v 5 Modificatio...

Page 15: ...roducts are not designed authorized or warranted to be suitable for use in life support life critical or safety critical systems or equipment nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors and its suppliers accept no liability for inclusion ...

Page 16: ...in automotive applications to automotive specifications and standards customer a shall use the product without NXP Semiconductors warranty of the product for such automotive applications use and specifications and b whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customer s own risk and c customer fully indemnifies...

Page 17: ...ormation 19 Contents 1 General description 1 2 Features and benefits 1 3 Ordering information 1 4 Marking 1 5 Functional diagram 2 6 Pinning information 2 6 1 Pinning 2 6 2 Pin description 3 7 Functional description 3 8 Limiting values 3 9 Recommended operating conditions 3 10 Static characteristics 4 10 1 Typical pass voltage graphs 5 11 Dynamic characteristics 7 12 Waveforms 7 13 Test informatio...

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