TECHNICAL SPECIFICATION
1-22
Requirements:
1. Set should function normally
2. Temperature rise of accessible parts such as metallic enclosures (casing) shall not exceed 40
˚
C
above the ambient temperature.
3. Temperature rise of PCB prints shall not exceed 85
˚
C
4. Temperature readings of all mechanical / electrical components and modules shall not exceed their
specification limits. The calculated junction temperature of semiconductors shall also not exceed
spec limits.
4.1.3 Noise
Specifications
Test Conditions:
Measurements are to be made inside an Anechoic Chamber (echo-free environment) with ambient noise of
less than 16dBA.
Measurements are to be taken at the following positions: -
(a) Top-Surface and at center of Front-Cabinet
(b) Front-Surface and at center of Front-Cabinet.
The microphone is to be positioned
10cm
from above mentioned surfaces.
Set Functional State
Requirement
Normal
Idle State
Standby Mode
< 20 dBA
Set On and "No Disc" mode
< 20 dBA
Tray Open/Close
Start/End peak noise
< 65 dBA
Tray running noise (RMS)
< 50 dBA
CDDA & SACD
Stop to Play peak noise
< 35 dBA
(Stereo & Multichannel)
Play (first & last tracks)
<30 dBA
Search Forward & Backward (all speeds)
<33 dBA
Pause (first & last tracks)
< 28 dBA
Jump Forward (first to last track)
<38dBA
Jump Backwards (last to first track)
<38dBA
Commercial Disc
Stop to Play peak noise
< 35 dBA
Play (inner & outermost title, Layer 0)
< 30dBA
Search Forward & Backward (all speeds)
< 35 dBA
Pause (inner & outermost title, Layer 0)
< 30 dBA
Jump Forward (inner to outermost title)
< 40 dBA
Jump Backwards (outer to innermost title)
< 40 dBA
Layer Jump (layer 0 to layer 1)
< 40 dBA
Summary of Contents for BT2500B/W-00
Page 27: ...3 2 WIRING DIAGRAM ...
Page 30: ...5 1 TOP BOARD LAYOUT ...
Page 31: ...5 2 BOTTOM BOARD LAYOUT ...
Page 32: ...6 1 Exploded drawing 7 3 2 1 5 SPK 9 4 6 8 7 ...
