Philips 32MF338B/27, Service Manual

Page: 14 / 93

14 FUZ2.0U LA
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Fig. S-1-1
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2