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DOCUMENT NUMBER: 21354 
DOCUMENT REVISION: 

D

 

ECN: 46162 

 

Component Name 

Hazardous Substances 

Lead 
(Pb) 

Mercury 
(Hg) 

Cadmium 
(Cd) 

Chromium VI 
Compounds 
(Cr(VI)) 

Polybrominated 
Biphenyls 
(PBB) 

Polybrominated 
Diphenyl 
Ethers (PBDE) 

Housing 

PCB Board 

Electrical 
Connectors 

Piezoelectric 
Crystals 

Epoxy 

Teflon 

Electronics 

Thick Film 
Substrate 

Wires 

Cables 

Plastic 

Solder 

Copper Alloy/Brass 

This table is prepared in accordance with the provisions of SJ/T 11364. 

O: Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit 
requirement of GB/T 26572. 

X: Indicates that said hazardous substance contained in at least one of the homogeneous materials for this part is above 
the limit requirement of GB/T 26572. 
Lead is present due to allowed exemption in Annex III or Annex IV of the European RoHS Directive 2011/65/EU. 

Summary of Contents for 3503C2020KG

Page 1: ...riaxial Shock Accelerometer Installation and Operating Manual For assistance with the operation of this product contact PCB Piezotronics Inc Toll free 800 828 8840 24 hour SensorLine 716 684 0001 Fax...

Page 2: ...ty regimen When in doubt about a calibration cycle a good rule of thumb is to recalibrate on an annual basis It is also good practice to recalibrate after exposure to any severe temperature extreme sh...

Page 3: ...rchase Order should include authorization to proceed and return at current pricing which can be obtained from a factory customer service representative Contact Information International customers shou...

Page 4: ...isclosure Table Pb Hg Cd Cr VI PBB PBDE O O O O O O PCB X O O O O O O O O O O O X O O O O O O O O O O O O O O O O O O O O O O O O O X O O O O O O O O O X O O O O O O O O O O O X O O O O O X O O O O O...

Page 5: ...e O O X O O O Wires O O O O O O Cables X O O O O O Plastic O O O O O O Solder X O O O O O Copper Alloy Brass X O O O O O This table is prepared in accordance with the provisions of SJ T 11364 O Indica...

Page 6: ...icro electromechanical systems MEMS technology in which all structural and electronic components are manufactured in silicon using electronic microfabrication technologies MEMS devices are preferred i...

Page 7: ...ck the mounting torque after each measurement It s also recommended that a thread locking adhesive be applied to any threads if applicable Ceramic LCC leadless chip carrier packages available in this...

Page 8: ...ipment for repair it is recommended that the user confer with a factory application engineer or inter national representative to first troubleshoot the problem 11 0 Return Procedure To expedite the re...

Page 9: ...g Hermetic Hermetic Size Height x Length x Width 0 15 in x 0 38 in x 0 28 in 3 8 mm x 9 6 mm x 7 1 mm Weight 0 029 oz 0 82 gm 4 Electrical Connector Solder Tabs Solder Tabs Mounting Surface Mount Surf...

Page 10: ...2 DEGREES FILLETS AND RADII 003 005 FILLETS AND RADII 0 07 0 13 OUTLINE DRAWING 58195 1 OF 1 5X MODEL 3503C20xx SERIES SMT TRIAXIAL ACCELEROMETER DECIMALS XX 03 XXX 010 DECIMALS X 0 8 XX 0 25 KRM 7 2...

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