4
TH-85VX200C
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
Summary of Contents for TH-85VX200C
Page 6: ...6 TH 85VX200C 3 Service Navigation 3 1 Service Hint...
Page 8: ...8 TH 85VX200C 3 2 Applicable signals...
Page 15: ...15 TH 85VX200C 6 2 IIC mode structure following items value is sample data...
Page 43: ...43 TH 85VX200C 37 Exchange the Plasma Display Panel...
Page 48: ...48 TH 85VX200C 10 1 9 Adjustment Volume Location 10 1 10 Test Point Location...
Page 50: ...50 TH 85VX200C...
Page 52: ...52 TH 85VX200C...
Page 53: ...TH 85VX200C 53 11 Block Diagram 11 1 Diagram Notes...
Page 64: ...TH 85VX200C 64...
Page 65: ...65 TH 85VX200C 12 Wiring Connection Diagram 12 1 Wiring 1...
Page 66: ...66 TH 85VX200C 12 2 Wiring 2...
Page 67: ...67 TH 85VX200C 12 3 Wiring 3...
Page 68: ...Model No TH 85VX200C Exploded View...
Page 69: ...Model No TH 85VX200C Side Power part location...
Page 70: ...Model No TH 85VX200C Cabinet part location...
Page 71: ...Model No TH 85VX200C Fan part location...
Page 72: ...Model No TH 85VX200C Rear cover location...
Page 73: ...Model No TH 85VX200C Print Circuit Board...
Page 74: ...Model No TH 85VX200C Flat cable...
Page 75: ...Model No TH 85VX200C Packing and Accessories 1...
Page 76: ...Model No TH 85VX200C Packing 2...
Page 77: ...Model No TH 85VX200C Packing 3...