
4
TH-65PF12EK
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
Summary of Contents for TH-65PF12EK
Page 7: ...7 TH 65PF12EK 3 2 Applicable signals ...
Page 9: ...9 TH 65PF12EK 5 Operating Instructions ...
Page 15: ...15 TH 65PF12EK 6 2 IIC mode structure following items value is sample data ...
Page 37: ...37 TH 65PF12EK 10 1 4 Adjustment Volume Location 10 1 5 Test Point Location ...
Page 39: ...39 TH 65PF12EK ...
Page 41: ...41 TH 65PF12EK ...
Page 42: ...42 TH 65PF12EK ...
Page 50: ...TH 65PF12EK 50 ...
Page 51: ...51 TH 65PF12EK 12 Wiring Connection Diagram 12 1 Wiring 1 ...
Page 52: ...52 TH 65PF12EK ...
Page 53: ...53 TH 65PF12EK 12 2 Wiring 2 ...
Page 54: ...54 TH 65PF12EK ...
Page 55: ...TH 65PF12EK 55 13 Schematic Diagram 13 1 Schematic Diagram Notes ...
Page 99: ...TH 65PF12EK 99 A B C D E F G H I 1 2 3 4 5 6 P MULTI BOARD COMPONENT SIDE ETX2MM774MA ...
Page 120: ...TH 65PF12EK 120 ...
Page 166: ...Model No TH 65PF12EK Important Safety Notice ...
Page 167: ...Model No TH 65PF12EK Exploded View ...
Page 168: ...Model No TH 65PF12EK Cabinet part location ...
Page 169: ...Model No TH 65PF12EK Fan part location ...
Page 170: ...Model No TH 65PF12EK Flat cable ...
Page 171: ...Model No TH 65PF12EK Packing and Accessories 1 ...
Page 172: ...Model No TH 65PF12EK Packing 2 ...
Page 173: ...Model No TH 65PF12EK Packing 3 ...