
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-37PG9W / TH-42PG9W
Summary of Contents for TH-37PG9W
Page 4: ...1 Applicable signals 4 TH 37PG9W TH 42PG9W ...
Page 26: ...8 4 Adjustment Volume Location 8 4 1 TH 37PG9W 8 4 2 TH 42PG9W 26 TH 37PG9W TH 42PG9W ...
Page 27: ...8 5 Test Point Location 8 5 1 TH 37PG9W 8 5 2 TH 42PG9W 27 TH 37PG9W TH 42PG9W ...
Page 31: ...9 2 IIC mode structure following items value is sample data 31 TH 37PG9W TH 42PG9W ...
Page 33: ...33 TH 37PG9W TH 42PG9W ...
Page 35: ...35 TH 37PG9W TH 42PG9W ...
Page 38: ...38 TH 37PG9W TH 42PG9W ...
Page 41: ...12 Option Setting 41 TH 37PG9W TH 42PG9W ...
Page 71: ...14 Block and Schematic Diagram 14 1 Schematic Diagram Notes TH 37PG9W TH 42PG9W 71 ...
Page 130: ...NOTE TH 37PG9W TH 42PG9W 130 ...
Page 131: ...15 Parts Location 15 1 Exploded View 131 TH 37PG9W TH 42PG9W ...
Page 132: ...15 2 Cable relation 132 TH 37PG9W TH 42PG9W ...
Page 133: ...15 3 Packing summary 133 TH 37PG9W TH 42PG9W ...
Page 134: ...134 TH 37PG9W TH 42PG9W ...
Page 136: ...17 Replacement Parts List 17 1 Replacement Parts List Notes 136 TH 37PG9W TH 42PG9W ...