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TH-103PF12U
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
Summary of Contents for TH-103PF12U
Page 6: ...6 TH 103PF12U 3 Service Navigation 3 1 Service Hint ...
Page 8: ...8 TH 103PF12U 3 2 Applicable signals ...
Page 9: ...9 TH 103PF12U ...
Page 11: ...11 TH 103PF12U 5 Operating Instructions ...
Page 16: ...16 TH 103PF12U 6 2 IIC mode structure following items value is sample data ...
Page 54: ...54 TH 103PF12U 10 1 9 Adjustment Volume Location 10 1 10 Test Point Location ...
Page 56: ...56 TH 103PF12U ...
Page 58: ...58 TH 103PF12U ...
Page 59: ...TH 103PF12U 59 11 Block Diagram 11 1 Diagram Notes ...
Page 70: ...TH 103PF12U 70 ...
Page 71: ...71 TH 103PF12U 12 Wiring Connection Diagram 12 1 Wiring 1 ...
Page 72: ...72 TH 103PF12U 12 2 Wiring 2 ...
Page 73: ...73 TH 103PF12U 12 3 Wiring 3 ...
Page 74: ...Model No TH 103PF12U Exploded View ...
Page 75: ...Model No TH 103PF12U Side Power part location ...
Page 76: ...Model No TH 103PF12U Cabinet part location ...
Page 77: ...Model No TH 103PF12U Fan part location ...
Page 78: ...Model No TH 103PF12U Rear cover location ...
Page 79: ...Model No TH 103PF12U Duct Barriers ...
Page 80: ...Model No TH 103PF12U Printed Circuit Board ...
Page 81: ...Model No TH 103PF12U Cable relation ...
Page 82: ...Model No TH 103PF12U Packing summary 1 ...
Page 83: ...Model No TH 103PF12U Packing summary 2 ...
Page 84: ...Model No TH 103PF12U Packing summary 3 ...
Page 85: ...Model No TH 103PF12U Packing summary 4 ...
Page 86: ...Model No TH 103PF12U Packing summary 5 ...
Page 87: ...Model No TH 103PF12U Packing summary 6 ...