4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semi-
conductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
Summary of Contents for SDR-H100P
Page 12: ...12 3 3 2 Precautions for installing HDD...
Page 16: ...16 4 Specifications...
Page 18: ...18...
Page 19: ...19...
Page 23: ...23 7 Service Fixture Tools 7 1 Service Tools and Equipment...
Page 26: ...26 Fig D2 Fig D3 Fig D4...
Page 28: ...28 Fig D7 Fig D8 Fig D9...
Page 30: ...30 Fig D14 Fig D15 Fig D16 Fig D17...
Page 31: ...31 Fig D18 Fig D19 Fig D20 Fig D21...
Page 32: ...32 Fig D22 Fig D23 Fig D24...
Page 33: ...33 Fig D25...
Page 35: ...35 8 4 1 How to use of CCD positioning pin RFKZ0476...
Page 38: ...38 9 3 Location for Connectors of the Main P C B 9 3 1 Main P C B...
Page 58: ...S 15 FT901 1 2 S601 2 4 SDR H100 H101 MONI FPC P C B S 15...
Page 63: ...S 20...
Page 71: ...S7 2 LCD Section S 28 15 17 16 18 34 19 20 21 33 B17 B26 B27...