7
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices.
The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge
(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
Precaution of Laser Diode
Caution:
This product utilizes a laser diode with the unit turned “on”, invisible laser radiation is emitted from the pickup lens.
Wavelength: 790 nm (CD)/655 nm (DVD)
Maximum output radiation power from pickup: 100
W/VDE
Laser radiation from the pickup unit is safety level, but be sure the followings:
1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.
Summary of Contents for SA-VKX25EE
Page 5: ...5 1 4 Caution For AC Cord For GS only Figure 1 3 ...
Page 12: ...12 5 Location of Controls and Components 5 1 Remote Control Key Button Operation ...
Page 13: ...13 5 2 Main Unit Key Button Operation ...
Page 14: ...14 6 Service Mode 6 1 Service Mode Table 6 2 Sales Demonstration Lock Function ...
Page 19: ...19 6 5 Self Diagnostic Mode 6 5 1 Self Diagnostic Mode Table 1 For DVD Module ...
Page 20: ...20 6 5 2 Self Diagnostic Mode Table 2 For DVD Module ...
Page 21: ...21 6 5 3 Self Diagnostic Mode Table 3 For DVD Module ...
Page 33: ...33 BACK END PCB 7 5 9 FP8101 Pin 5 Pin 7 Pin 9 Pin 11 5V 10 11 ...
Page 35: ...35 8 3 Main Components and P C B Locations ...
Page 44: ...44 ...
Page 54: ...54 ...
Page 56: ...56 ...
Page 78: ...78 ...
Page 86: ...86 ...
Page 90: ...90 ...