2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
6
Summary of Contents for SA-AKX32LM-K
Page 7: ...2 2 Precaution of Laser Diode Caution M 7 ...
Page 13: ...13 5 Location of Controls and Components 5 1 Main Unit Key Button Operation ...
Page 15: ...15 5 3 Media Information ...
Page 26: ...26 7 2 3 D Amp P C B Fig 3 D Amp P C B Audio Digital Amp IC IC5900 ...
Page 32: ...32 9 2 Main Components and P C B Locations ...
Page 62: ...Step 9 Ground the 24P FFC with a short pin 62 ...
Page 77: ...14 Simplified Block Diagram 14 1 Overall Simplified Block Diagram 77 ...
Page 115: ...19 Terminal Function of ICs 19 1 IC2003 MN101EF16KXW IC MICRO PROCESSOR 115 ...
Page 120: ...20 1 3 Mechanical Replacement Part List 120 ...
Page 121: ... 121 ...