
can generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe
all other safety precautions.
8. Minimize body motions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
5. Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
- Pb free solder has a higher melting point than standard solder;
Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please
use a high temperature soldering iron. In case of soldering iron
with temperature control, please set it to 700 ± 20°F (370 ± 10°C).
- Pb free solder will tend to splash when heated too high (about
1100°F/600°C).
6
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