Panasonic PAN1760A Product Specification Download | Manualshive

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PAN1760A

Bluetooth Low Energy Module

Product Specification

Rev. 1.1

Wireless Modules

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Summary of Contents for PAN1760A

Page 1: ...PAN1760A Bluetooth Low Energy Module Product Specification Rev 1 1 Wireless Modules ...

Page 2: ...uetooth GAP central and peripheral support for LE GATT SMP and SDB support for LE Over the Air firmware update Support for Scatternet Mesh network BT 4 2 secure connections support through Elliptic Curve DH Cryptography AES 128 hardware encryption FIPS approved Frequent changing of device address improved privacy reduced tracking ability Larger packet sizes more efficient application and network l...

Page 3: ... status Engineering Samples This means that the design of this product is not yet concluded Engineering Samples may be partially or fully functional and they may differ from the published Product Specification Engineering Samples are not qualified and they are not to be used for reliability testing or series production Disclaimer The customer acknowledges that samples may deviate from the Product ...

Page 4: ...commended Operating Conditions 18 4 4 Current Consumption 18 4 5 Bluetooth 19 4 6 Reliability Tests 19 4 7 Recommended Soldering Profile 20 5 Cautions 21 5 1 Design Notes 21 5 2 Installation Notes 21 5 3 Usage Condition Notes 22 5 4 Storage Notes 22 5 5 Safety Cautions 22 5 6 Other Cautions 23 5 7 Life Support Policy 23 6 Regulatory and Certification Information 24 6 1 Federal Communications Commi...

Page 5: ...2017 1st preliminary version 0 2 12 06 2017 Editorial review 1 0 12 06 2017 First published version 1 1 03 11 2017 Added MIC ID for Japanese Radio Law Added Bluetooth ID for Bluetooth Certification 1 3 Use of Symbols Symbol Description Note Indicates important information for the proper use of the product Non observance can lead to errors Attention Indicates important notes that if not observed ca...

Page 6: ...AN1760A can either be operated in AT Command or Host mode for very simple integration of Bluetooth connectivity into existing products or in Stand Alone mode In Stand Alone mode with 256 kB flash memory and 83 kB RAM for user application the PAN1760A can be used for many applications without the need for an external processor saving cost complexity and space Older versions of the PAN1760 the PAN17...

Page 7: ...1 Block Diagram Total capacitor value 2 4 µF 10 Total inductance 10 µH 10 Total resistance 100 KΩ 10 Chip Antenna Toshiba TC35678 Slow Clock 32 KHz UART GPIOs Host Wake up Wake up Reset Vcc 3 3 V LPF PAN1760A Bluetooth 4 2 Module Crystal 26 MHz DC DC Conversion Flash 256 kB SWD ...

Page 8: ...power supply connection A6 VCC Power Analog digital power supply connection A7 GND Ground Pin Connect to ground A8 NC NC Not connected A9 GND Ground Pin Connect to ground A11 GND Ground Pin Connect to ground A12 GND Ground Pin Connect to ground B1 GPIO9 Digital I O B2 GPIO4 Digital I O F2 F3 F4 F5 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 C1 C2 C3 C4 C5 C6 C7 C8 B1 B2 B3 B4 B5 B6 B7 B8 B9...

Page 9: ...nnected leave open C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to ground D1 NC NC Not connected leave open D2 NC NC Not connected leave open D3 NC NC Not connected leave open D4 GPIO0 WakeUp0 Digital I O D5 NC NC Not connected leave open D6 GPIO15 WakeUp1 Digital I O D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 ANT RF Signal Antenna pin not connected...

Page 10: ...TS F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground Minimal configuration VCC GND UART Rx Tx no flow control 2 3 UART Interface Default baud rate 115 200 bps Data format 8N1 LSB first Rx Tx no flow control 2 4 Bluetooth Features GAP central and peripheral support for LE GATT SMP and SDB support for LE Over the Air firmware update Support...

Page 11: ...etailed Description Product Specification Rev 1 1 Page 11 3 Detailed Description 3 1 Dimensions All dimensions are in millimeters No Item Dimension Tolerance Remark 1 Width 8 70 0 20 2 Length 15 60 0 20 3 Height 1 80 0 20 With case ...

Page 12: ...otprint The outer dimensions have a tolerance of 0 2 mm Top View F2 F3 F4 F5 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 C1 C2 C3 C4 C5 C6 C7 C8 B1 B2 B3 B4 B5 B6 B7 B8 B9 A2 A3 A4 A5 A6 A7 A8 A1 1 0 8 70 mm 0 6 5 0 0 6 1 35 1 35 1 2 F9 1 2 F7 F1 F8 D9 C9 A9 15 6 mm F6 F11 A11 F12 A12 2 4 ...

Page 13: ... the component packed area shall be less than two per reel and those spaces shall not be consecutive The top cover tape shall not be found on reel holes and it shall not stick out from the reel 100730 PAN1720 vsd trailer empty 1 x circumference hub min 160mm component packed area standard 1500pcs leader empty minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of...

Page 14: ... PAN1760A Bluetooth Module 3 Detailed Description Product Specification Rev 1 1 Page 14 3 3 3 Component Direction 3 3 4 Reel Dimension ...

Page 15: ... Detailed Description Product Specification Rev 1 1 Page 15 3 3 5 Package Label Example 1T 1P 2P 9D Q HW SW Lot code Customer order number if applicable Order number Date code Quantity Hardware software version 3 3 6 Total Package ...

Page 16: ...n Product Specification Rev 1 1 Page 16 3 4 Case Marking Example 1 2 3 4 5 6 7 8 9 MIC ID Brand name Hardware software version Order number FCC ID Lot code Engineering Sample marking if applicable Marking for Pin 1 2D barcode for internal usage only ...

Page 17: ... Maximum Ratings The maximum ratings may not be exceeded under any circumstances not even momentarily or individually as permanent damage to the module may result Symbol Parameter Condition Min Typ Max Units TSTOR Storage temperature 40 125 C VESD ESD robustness All pads according to human body model HBM JEDEC STD 22 method A114 1 000 V According to charged device model CDM JEDEC STD 22 method C10...

Page 18: ... the module may result Symbol Parameter Condition Min Typ Max Units TA Ambient operating temperature range 40 85 C VDD 3V3 Supply voltage 1 8 3 3 3 6 V 4 4 Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes Assume VDD 3 3 V Tamb 25 C if nothing else stated Parameter Condition Min Typ Max Units Transmit Peak Current 3 3 mA Receive...

Page 19: ...IB STD T 66 30 dBm 4 6 Reliability Tests The measurement should be done after the test device has been exposed to room temperature and humidity for one hour No Item Limit Condition 1 Vibration test Electrical parameter should be in specification Freq 10 50 Hz Amplitude 1 5 mm 20 min cycle 1 hrs each of XYZ axis Freq 30 100 Hz 6G 20 min cycle 1 hrs each of XYZ axis 2 Shock test See above Dropped on...

Page 20: ...ing Profile Reflow permissible cycle 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead free soldering ...

Page 21: ...sed It should not carry noise and or spikes 7 Keep this product away from other high frequency circuits 8 Refer to the recommended pattern when designing a board 5 2 Installation Notes 1 Reflow soldering is possible twice based on the conditions set forth in 4 7 Recommended Soldering Profile Set up the temperature at the soldering portion of this product according to this reflow profile 2 Carefull...

Page 22: ...racteristics of the product such as RF performance will be adversely affected Storage in salty air or in an environment with a high concentration of corrosive gas such as Cl2 H2S NH3 SO2 or NOX Storage in direct sunlight Storage in an environment where the temperature may be outside the range of 5 C to 35 C or where the humidity may be outside the 45 to 85 percent range Storage of the products for...

Page 23: ...olvent or in places where liquid may splash In direct sunlight outdoors or in a dusty environment In an environment where condensation occurs In an environment with a high concentration of harmful gas e g salty air HCl Cl2 SO2 H2S NH3 and NOX 5 If an abnormal voltage is applied due to a problem occurring in other components or circuits replace these products with new products because they may not ...

Page 24: ... s authority to operate the equipment This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordanc...

Page 25: ...na Warning This antenna warning refers to the test device with the model number PAN1760A Chapter 7 1 Ordering Information The device is tested with a standard SMA connector and with the antenna listed below When integrated into the OEM s product these fixed antennas require installation preventing end users from replacing them with non approved antennas Any antenna not in the following table must ...

Page 26: ...egrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance 6 2 Innovation Science and Economic Development ISED for Canada English The PAN1760A is licensed to meet the regulatory requirements of Industry Canada IC License ID IC 216Q 1760A Manufacturers of mobile fixed or portable devices incorporating this module are advised to clarify any r...

Page 27: ...atibles est 50 Ohm L antenne utilisée avec ce produit ne doit ni être située à proximité d une autre antenne ou d un autre émetteur ni être utilisée conjointement avec une autre antenne ou un autre émetteur En raison de la taille du produit l identifiant IC est fourni dans le manuel d installation 6 2 1 IC Notice English The device PAN1760A 7 1 Ordering Information including the antennas 6 1 5 App...

Page 28: ...etage Les fabricants d équipements d origine FEO en anglais Original Equipment Manufacturer OEM doivent s assurer que les obligations d étiquetage IC du produit final sont remplies Ces obligations incluent une étiquette clairement visible à l extérieur de l emballage externe comportant l identifiant IC du module Panasonic inclus ainsi que la notification ci dessus L identifiant IC est IC 216Q 1760...

Page 29: ...e the end customer equipment should be labelled as follows PAN1760A in the specified reference design can be used in all countries of the European Economic Area Member States of the EU European Free Trade Association States Iceland Liechtenstein Norway Monaco San Marino Andorra and Turkey 6 5 Bluetooth The final Bluetooth End Product listing needs to be created by using the following IDs QDID Decl...

Page 30: ...er Brand Name Description MOQ 1 ENW89847A3KF 2 PAN1760A Bluetooth Low Energy Module 1 500 1 Abbreviation for Minimum Order Quantity MOQ The default MOQ for mass production is 1 500 pieces fewer only on customer demand Samples for evaluation can be delivered at any quantity via the distribution channels 2 Samples are available on customer demand ...

Page 31: ...merica visit the Panasonic Sales Support Tool to find assistance near you at https na industrial panasonic com distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https forum na industrial panasonic com 7 2 2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents For complete...

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