manualshive.com logo in svg

Panasonic PAN1326C, Product Specification

Share
Download
Panasonic PAN1326C Product Specification Download Page 5

 

 

PAN1326C Bluetooth Module 

 

 

 

 

 

1 About This Document 

 

 

 

Product Specification Rev. 1.0 

 

Page 5 

 

1 

About This Document 

1.1  Purpose and Audience 

This Product Specification provides details on the functional, operational, and electrical 
characteristics of the Panasonic PAN1326C module. It is intended for hardware design, 
application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to 
as “the PAN1326C” or “the module” within this document. 

 

1.2  Revision History 

Revision 

Date 

Modifications/Remarks 

1.0 

November 2017  1st version. 

 

1.3  Use of Symbols 

Symbol 

Description 

 

Note 

Indicates important information for the proper use of the product. 
Non-observance can lead to errors. 

 

Attention 

Indicates important notes that, if not observed, can put the product’s functionality 
at risk. 

 [chapter number] 

[chapter title] 

Cross reference 

Indicates cross references within the document. 

Example: 

Description of the symbols used in this document 

 1.3 Use of Symbols

. 

 

1.4  Related Documents 

Please refer to the Panasonic website for related documents 

 6.2.2 Product Information. 

Summary of Contents for PAN1326C

Page 1: ...PAN1326C Bluetooth Basic Data Rate and Low Energy Module Product Specification Rev 1 0 Wireless Modules ...

Page 2: ...few as two layers for easy implementation and manufacturing The module has been designed to be 100 pin compatible with previous generations of Texas Instruments based Bluetooth HCI modules Features Bluetooth 4 2 compliant up to the HCI layer Best in class Bluetooth RF performance Tx Rx sensitivity blocking Dimensions 9 0 mm x 9 5 mm x 1 8 mm Based upon TI s CC2564C Interfaces UART GPIO PCM Charact...

Page 3: ... status Engineering Samples This means that the design of this product is not yet concluded Engineering Samples may be partially or fully functional and they may differ from the published Product Specification Engineering Samples are not qualified and they are not to be used for reliability testing or series production Disclaimer The customer acknowledges that samples may deviate from the Product ...

Page 4: ...Footprint 21 3 3 Packaging 23 3 4 Case Marking 27 4 Specification 28 4 1 Default Test Conditions 28 4 2 Absolute Maximum Ratings 28 4 3 Recommended Operating Conditions 29 4 4 Current Consumption 29 4 5 nSHUTD Requirements 30 4 6 External Digital Slow Clock Requirements 30 4 7 Bluetooth 30 4 8 Reliability Tests 33 4 9 Recommended Soldering Profile 34 5 Cautions 35 5 1 Design Notes 35 5 2 Installat...

Page 5: ...within this document 1 2 Revision History Revision Date Modifications Remarks 1 0 November 2017 1st version 1 3 Use of Symbols Symbol Description Note Indicates important information for the proper use of the product Non observance can lead to errors Attention Indicates important notes that if not observed can put the product s functionality at risk chapter number chapter title Cross reference Ind...

Page 6: ...ormance with about twice the range of other Bluetooth Low Energy solutions Panasonic s tiny footprint technology has produced a module of only 85 5 mm The module is designed to accommodate PCBs pad pitch of 1 3 mm and as few as two layers for easy implementation and manufacturing The module has been designed to be 100 pin compatible with previous generations of Texas Instruments based Bluetooth HC...

Page 7: ...T PIN can not be used as reference due to RF internal connection The total capacity will not exceed 2 8uF and the total inductance will not exceed 0nH There are no voltage multiplying or voltage boosting circuits Texas Instruments CC256x BT HCI Chip UART GPIOs Audio PCM I2C Reset 32 kHz input Vcc 3 3 V LPF PAN131x Bluetooth 4 2 Module Crystal 26 MHz RF Pad Chip Antenna Texas Instruments CC256x BT ...

Page 8: ...ent PAN1316C Top View PIN Assignment PAN1326C 17 15 13 14 11 9 8 6 5 3 2 21 22 10 4 16 Top View 9 00 mm 6 50 mm 20 23 1 24 19 18 12 7 Pad 24 x 0 60mm x 0 60mm Module Height 1 8 mm 17 15 13 14 11 9 8 6 5 3 2 21 22 10 4 16 Pad 28 x 0 60mm x 0 60mm Top View 9 00 0 55 1 80 9 50 0 60 20 23 1 24 19 18 12 7 A C B D ...

Page 9: ...o Ground 13 RF IO Bluetooth RF IO 14 GND Connect to Ground 15 MLDO_IN I Main LDO input 16 nSHUTD PD I Shutdown input active low 17 AUD_OUT PD O 4 mA PCM data output NC if not used Fail Safe 18 AUD_IN PD I 4 mA PCM data input NC if not used Fail Safe 19 AUD_CLK PD IO HY 4 mA PCM clock NC if not used Fail Safe 20 GND Connect to Ground 21 NC EEPROM I C SDA Internal 22 VDD_IO PI I O power supply 1 8 V...

Page 10: ...O Bluetooth RF IO not connected with antenna nSHUTD 16 1000 PD I Shutdown input active low Bluetooth POWER AND GND SIGNALS VDD_IO 22 1000 PI I O power supply 1 8 V Nom MLDO_IN 15 1000 I Main LDO input Connect directly to battery or to a pre regulated 1 8 V supply MLDO_OUT 10 1000 O Main LDO output 1 8 V nom Can not be used as 1 8V supply due to internal connection to the RF part CL1 5_LDO_IN 11 10...

Page 11: ...d devices One of the main differentiators of the PAN13x6C is its power management its ability to draw as little current as possible The PAN13x6C device requires two kinds of power sources 1 Main power supply for the Bluetooth VDD_IN VBAT 2 Power source for the 1 8 V I O ring VDD_IO The PAN13x6C includes several on chip voltage regulators for increased noise immunity The PAN13x6C can be connected e...

Page 12: ...here are three ways to supply power 1 Full VBAT system Maximum RF output power but not optimum system power 2 Full DC2DC system Lower RF output power but optimum system power 3 Mixed DC2DC VBAT system Maximum RF output power and optimum system power but requires routing of VBAT ...

Page 13: ...two Synchronous Connection Oriented SCO links on the same piconet Support for All Voice Air Coding Continuously Variable Slope Delta CVSD A law µ law modified Subband Coding mSBC and transparent uncoded Assisted mode for HFP 1 6 Wideband Speech WBS profile or A2DP profile to reduce host processing and power Support of multiple Bluetooth profiles with enhanced QoS Multiple sniff instances tightly c...

Page 14: ...564C responds with a Command Complete Event still at 115 2 kbps after which the baud rate change takes place HCI hardware includes the following features Receiver detection of break idle framing FIFO overflow and parity error conditions Transmitter underflow detection CTS RTS hardware flow control The interface includes four signals TXD RXD CTS and RTS Flow control between the host and the CC2564C...

Page 15: ...ction input or output Data In Input Data Out Output 3 state The Bluetooth device can be either the master of the interface where it generates the clock and the frame sync signals or slave where it receives these two signals The PCM interface is fully configured by a vendor specific command For slave mode clock input frequencies of up to 16 MHz are supported At clock rates above 12 MHz the maximum ...

Page 16: ...the PCM clock can take a break and become 0 at the end of the PCM frame after all data has been transferred The CC2564C supports frame idle periods both as master and slave of the PCM bus When CC2564C is the master of the interface the frame idle period is configurable There are two configurable parameters Clk_Idle_Start Indicates the number of PCM clock cycles from the beginning of the frame unti...

Page 17: ...f the PCM bus The frame sync signal is updated by the codec on the falling clock edge and therefore shall be sampled by the CC2564C on the next rising clock The data from the codec is sampled by the CC2564C on the clock falling edge 2 6 2 5 Two Channel PCM Bus Example In below figure a 2 channel PCM bus is shown where the two channels have different word sizes and arbitrary positions in the bus fr...

Page 18: ...ata faster than the codec I F output allows an overflow will occur In this case the Bluetooth has two possible behaviour modes allow overflow and don t allow overflow If overflow is allowed the Bluetooth will continue receiving data and will overwrite any data not yet sent to the codec If overflow is not allowed RF voice packets received when buffer is full will be discarded 2 6 2 9 Bluetooth Inte...

Page 19: ...ption Product Specification Rev 1 0 Page 19 3 Detailed Description 3 1 Dimensions All dimensions are in millimeters 3 1 1 PAN1316C Module Drawing No Item Dimension Tolerance Remark 1 Width 6 50 0 30 2 Length 9 00 0 30 3 Height 1 80 0 20 With case ...

Page 20: ...C Bluetooth Module 3 Detailed Description Product Specification Rev 1 0 Page 20 3 1 2 PAN1326C Module Drawing No Item Dimension Tolerance Remark 1 Width 9 50 0 30 2 Length 9 00 0 30 3 Height 1 80 0 20 With case ...

Page 21: ...ave a tolerance of 0 2 mm The layout is symmetric to center The inner pins 2 4 6 9 11 14 16 18 21 and 23 are shifted to the center by 1 mm 3 2 1 Footprint PAN1316C Without Antenna 0 90 1 70 6 50 0 90 1 80 9 00 17 15 13 14 12 11 9 8 7 6 5 3 2 1 23 24 21 18 19 20 22 10 4 16 Pad 24 x 0 60mm x 0 60mm Top View 1 80 2 70 2 95 3 95 ...

Page 22: ... PAN1326C Bluetooth Module 3 Detailed Description Product Specification Rev 1 0 Page 22 3 2 2 Footprint PAN1326C With Antenna ...

Page 23: ... 0 10 0 10 0 30 7 50 12 00 16 00 K1 2 00 0 10 Estimated max length 72 meter 22B3 reel Forming format Flatbed 9 2 80 0 10 0 10 9 40 B o Ko 6 90 A o 0 10 Y Y X X SECTION Y Y SCALE 3 5 1 SECTION X X SCALE 3 5 1 Measured from centreline of sprocket hole Measured from centreline of sprocket hole Cumulative tolerance of 10 sprocket Measured from centreline of sprocket to centreline of pocket holes is 0 ...

Page 24: ... not be found on reel holes and it shall not stick out from the reel trailer empty 1 x circumference hub min 160mm component packed area standard 1500pcs leader empty minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules Direction of unreeling for customer PAN1315 01 01 ENW89809M5A YYWWDLL FCC ID T7V1315 Machine readable 2D Barcode PAN...

Page 25: ...on Rev 1 0 Page 25 3 3 3 Component Direction 3 3 4 Reel Dimension PAN1315 01 01 ENW89809M5A YYWWDLL FCC ID T7V1315 Machine readable 2D Barcode Direction of unreeling for customer Pin 1 Marking Top Side Pin 1 Marking Bottom Side Circle r 0 5 mm on solder resist near Pin 1 ...

Page 26: ... Detailed Description Product Specification Rev 1 0 Page 26 3 3 5 Package Label Example 1T 1P 2P 9D Q HW SW Lot code Customer order number if applicable Order number Date code Quantity Hardware software version 3 3 6 Total Package ...

Page 27: ...Bluetooth Module 3 Detailed Description Product Specification Rev 1 0 Page 27 3 4 Case Marking Example 1 2 3 4 7 8 Brand name Hardware software version Order number 2D Data Matrix Code Lot code Marking for Pin 1 ...

Page 28: ...3 Input voltage to RF Pin 13 0 5 to 2 1 V 4 Operating ambient temperature range 40 to 85 C 5 Storage temperature range 40 to 125 C 6 Bluetooth RF inputs Pin 13 10 dBm 7 ESD Human Body Model HBM JEDEC 22 A114 500 V 7 VDD_IN is supplied to MLDO_IN Pin 15 and CL1 5_LDO_IN Pin 11 other options are described in Chapter 2 3 8 Stresses beyond those listed under absolute maximum ratings may cause permanen...

Page 29: ...n VDD_IN VBAT duration 577 s to 2 31 ms period 4 6 ms 400 mV 8 Maximum ambient operating temperature 12 85 C 9 Minimum ambient operating temperature 13 40 C 4 4 Current Consumption No Characteristics Min 25 C Typ 25 C Max 25 C Min 40 C Typ 40 C Max 40 C Min 85 C Typ 85 C Max 85 C Unit 1 Current consumption in shutdown mode 14 1 3 7 A 2 Current consumption in deep sleep mode 15 40 105 700 A 3 Total...

Page 30: ...uetooth 250 Ppm 3 Input transition time Tr Tf 10 to 90 Tr Tf 100 Ns 4 Frequency input duty cycle 15 50 85 5 Phase noise at 1 kHz 125 dBc Hz 6 Jitter Integrated over 300 to 15000 Hz 1 Hz 7 Slow clock input voltage limits Square wave DC coupled VIH 0 65 x VDD_IO VDD_IO V peak VIL 0 0 35 x VDD_IO 8 Input impedance 1 M 9 Input capacitance 5 pF 4 7 Bluetooth No Characteristics Condition Min Typ Max BT ...

Page 31: ...Hz 4 3 40 40 19 Max Drift Ch39_DH5 kHz 4 3 40 40 20 Max Drift Rate Ch39_DH1 kHz 3 1 20 20 21 Max Drift Rate Ch39_DH3 kHz 3 6 20 20 22 Max Drift Rate Ch39_DH5 kHz 3 7 20 20 23 Max Drift Ch78_DH1 kHz 4 1 25 25 24 Max Drift Ch78_DH3 kHz 4 5 40 40 25 Max Drift Ch78_DH5 kHz 4 4 40 40 26 Max Drift Rate Ch78_DH1 kHz 3 4 20 20 27 Max Drift Rate Ch78_DH3 kHz 3 9 20 20 28 Max Drift Rate Ch78_DH5 kHz 4 1 20 ...

Page 32: ...0 73 DEVM RMS 2 DH5 Ch0 0 0 0 2 74 DEVM Peak 2 DH5 Ch0 0 1 0 35 75 DEVM 99 2 DH5 Ch0 100 0 99 76 omega i 3 DH5 Ch0 kHz 3 7 75 75 77 omega o omega i 3 DH5 Ch0 kHz 5 8 75 75 78 omega o 3 DH5 Ch0 kHz 2 6 10 10 79 DEVM RMS 3 DH5 Ch0 0 0 0 13 80 DEVM Peak 3 DH5 Ch0 0 1 0 25 81 DEVM 99 3 DH5 Ch0 100 0 99 82 omega i 2 DH5 Ch39 kHz 4 8 75 75 83 omega o omega i 2 DH5 Ch39 kHz 6 1 75 75 84 omega o 2 DH5 Ch3...

Page 33: ...ld be done after the test device has been exposed to room temperature and humidity for one hour No Item Limit Condition 1 Vibration test Electrical parameter should be in specification Freq 10 50 Hz Amplitude 1 5 mm 20 min cycle 1 hrs each of XYZ axis Freq 30 100 Hz 6G 20 min cycle 1 hrs each of XYZ axis 2 Shock test See above Dropped onto hard wood from a height of 50 cm for 3 times 3 Heat cycle ...

Page 34: ...ing Profile Reflow permissible cycle 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead free soldering ...

Page 35: ...sed It should not carry noise and or spikes 7 Keep this product away from other high frequency circuits 8 Refer to the recommended pattern when designing a board 5 2 Installation Notes 1 Reflow soldering is possible twice based on the conditions set forth in 4 9 Recommended Soldering Profile Set up the temperature at the soldering portion of this product according to this reflow profile 2 Carefull...

Page 36: ...racteristics of the product such as RF performance will be adversely affected Storage in salty air or in an environment with a high concentration of corrosive gas such as Cl2 H2S NH3 SO2 or NOX Storage in direct sunlight Storage in an environment where the temperature may be outside the range of 5 C to 35 C or where the humidity may be outside the 45 to 85 percent range Storage of the products for...

Page 37: ...olvent or in places where liquid may splash In direct sunlight outdoors or in a dusty environment In an environment where condensation occurs In an environment with a high concentration of harmful gas e g salty air HCl Cl2 SO2 H2S NH3 and NOX 5 If an abnormal voltage is applied due to a problem occurring in other components or circuits replace these products with new products because they may not ...

Page 38: ...oth Basic Data Rate and Low Energy Module w o antenna 1 500 ENW89823A4KF 18 PAN1326C Bluetooth Basic Data Rate and Low Energy Module w antenna 1 500 17 Abbreviation for Minimum Order Quantity MOQ The default MOQ for mass production is 1 500 pieces fewer only on customer demand Samples for evaluation can be delivered at any quantity via the distribution channels 18 Samples are available on customer...

Page 39: ...merica visit the Panasonic Sales Support Tool to find assistance near you at https na industrial panasonic com distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https forum na industrial panasonic com 6 2 2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents For complete...

Reviews:

No comments

Brands by name

Popular brands

Load more brands