Panasonic PAN1322-SPP, User Manual

Page: 37 / 52

User’s Manual 37 Revision 1.3, 2013-08-14
Hardware Description
PAN1322-SPP
ENW89841A3KF
Assembly Guidelines
10 Assembly Guidelines
The target of this chapter is to provide guidelines for customers to successfully introduce the PAN1322-SPP
module in production. This includes general description, PCB-design, solder printing process, assembly, soldering
process, rework and inspection.
10.1 General Description of the Module
PAN1322-SPP is a Land Grid Array (LGA 8.7mm x 15.6mm) module made for surface mounting. The pad
diameter is 0.6 mm and the pitch 1.2 mm.
All solder joints on the module will reflow during soldering on the mother board. All components and shield will stay
in place due to wetting force. Wave soldering is not possible.
Surface treatment on the module pads is Nickel (5 - 8 µm)/Gold (0.04 - 0.10 µm).
Figure 13 shows the pad layout on the module, seen from the component side.
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8 A1
1.0
8.70
mm
0.6
5.0
0.6
1.35
1.35
1.2
F9
1.2
F7 F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
Figure 13 Pad Layout on the Module (top view)
10.2 Printed Circuit Board Design
The land pattern on the PCB shall be according to the land pattern on the module, which means that the diameter
of the LGA pads on the PCB shall be 0.6 mm. It is recommended that each pad on the PCB shall be surrounded
by a solder mask clearance of about 75 µm to avoid overlapping solder mask and pad.