
corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
the soldering iron.
6.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as
shown in below figure.
7. CPU DATA
7.1. IC801
14
Summary of Contents for KX-TS105LXW
Page 2: ...2 ...
Page 12: ...5 DISASSEMBLY INSTRUCTIONS 12 ...
Page 15: ...7 2 Speakerphone IC Data 15 ...
Page 18: ...9 BLOCK DIAGRAM 10 BLOCK DIAGRAM IC 1 18 ...
Page 24: ...24 ...
Page 25: ...12 TROUBLE SHOOTING GUIDE 12 1 Service Hints 25 ...
Page 27: ...12 4 No Ringing Sound When Ring Signal is Input 27 ...
Page 28: ...13 CABINET AND ELECTRICAL PARTS LOCATION 28 ...
Page 29: ...29 ...
Page 34: ...R104 ERJ3GEYJ473 47k 34 ...
Page 41: ...E C B E C B E C B E C B B C E B C E B C E IC601 IC903 ...