Panasonic KX-TG4011N, Service Manual

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KX-TG4011N/KX-TG4012N/KX-TG4013N/KX-TGA402N
13.2. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description is only applied on the model with Shield case.
13.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°
F ± 20
°
F (370
°
C ± 10
°
C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608
°
F ± 68
°
F (320
°
C ± 20
°
C)
13.2.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.