
After removing the Flat IC and when attaching the new IC, remove any of the excess solder on
the land using the soldering wire, etc. If the excess solder is not removed from the land, the IC
will slip and not be attached properly.
11.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two marked
pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by
sliding the soldering iron.
11.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly re-solder the bridged portion.
2. Remove the remaining solder along pins using a soldering iron as
shown in the figure below.
Summary of Contents for KX-TD7895 - Digital Spread Spedtrum Telephone
Page 3: ...3 2 CONNECTIONS OF HANDSET ...
Page 4: ...3 3 BASE UNIT ...
Page 5: ...4 DISASSEMBLY INSTRUCTIONS 4 1 BASE UNIT ...
Page 6: ...1 Remove the four screws A and remove the Bottom Cabinet ...
Page 9: ...2 Take the Battery out of the Rear Cabinet after disconnecting the Connector ...
Page 10: ...3 Remove two Screws D from the Rear Cabinet ...
Page 12: ...6 Remove the Antenna from the Front Cabinet after removing the Screw E ...
Page 13: ...7 Remove the RF unit from the Main Board ...
Page 20: ...34 CHARGE I ON OFF ...
Page 23: ...6 4 RF UNIT FREQUENCY TABLE ...
Page 32: ...10 TROUBLESHOOTING GUIDE 10 1 NO VOICE RECEPTION 10 2 NO VOICE TRANSMISSION ...
Page 33: ...10 3 NO LINK BASE UNIT ...
Page 39: ...12 CABINET AND ELECTRICAL PARTS LOCATION 12 1 BASE UNIT ...
Page 40: ...12 2 HANDSET ...
Page 41: ...12 3 CHARGER ...
Page 42: ...13 ACCESSORIES AND PACKING MATERIALS ...
Page 46: ... CAPACITORS ...
Page 63: ......
Page 64: ......