Ref. No.
Procedure Shown in Fig —.
To remove —.
Remove —.
1
1
1
Lower Cabinet
Screws (2.6 × 12)............. (A) × 5
2
1 ~ 2
2
Printed Circuit Board
Remove the P.C.Board
6. HOW TO REPLACE FLAT PACKAGE IC
6.1. Preparation
- SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
- Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 80 W iron, but beginner
might damage foil by overheating.)
- Flux
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)
6.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2
pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
6
Summary of Contents for KX-T2371MXW
Page 2: ...1 LOCATION OF CONTROLS 2 CONNECTION 2 ...
Page 3: ...3 OPERATIONS 3 1 Making Calls 3 ...
Page 4: ...3 2 Answering Calls 4 SPECIAL FEATURES 4 1 For Call Waiting Service Users 4 ...
Page 8: ...8 TERMINAL GUIDE OF IC S TRANSISTORS AND DIODES 9 IC BLOCK DIAGRAM 8 ...
Page 14: ...13 3 Problems With the Handset 14 ...
Page 16: ...16 ...
Page 19: ...19 ...
