9
3.5.
Formatting
3.6.
Baking of IC and P.C.B.
The baking mentioned here is the way of dehumidification of IC and P.C.B..
It's possible to improve the success rate of IC replacement for repair by baking of IC and P.C.B..
When replacing the hygroscopic IC and P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B. might sometimes occur
by rapid heating.
For that case, please test the baking of IC and P.C.B. before replacing IC in order to prevent the above mentioned problem.
IC( Service parts) and P.C.B. should be put in the heater together.
Reference value for baking temperature and time is as follows.
• Baking temperature and time (Hour)
80
°
C / 12 hour
[ Note ]
This setting value of temperature and time (Hour) is actually used in Japan.
An appropriate setting value changes depending on the environmental condition of the work place in your country.
However, the setting temperature must not exceed 125
°
C.
Summary of Contents for HX-WA2P
Page 10: ...10 4 Specifications...
Page 11: ...11...
Page 12: ...12...
Page 15: ...15 6 Troubleshooting Guide 6 1 Confirmation Flow of Waterproof...
Page 16: ...16 6 2 Airtight Inspection with Air Leak Tester...
Page 17: ...17 6 3 Air Leak Tester RFKZ0528 Operating Instruction...
Page 18: ...18...
Page 19: ...19...
Page 20: ...20...
Page 25: ...25 Fig D4 Fig D5...
Page 27: ...27 Fig D10 8 3 6 Removal of the Capacitor Capacitor Holder Fig D11...
Page 28: ...28 8 3 7 Removal of the Lens Unit Fig D12 Fig D13...
Page 30: ...30 Fig D16 8 3 10 Removal of the Lens Holder Fig D17 8 3 11 Removal of the Speaker Fig D18...
Page 31: ...31 8 3 12 Removal of the LCD Unit Fig D19 Fig D20...
Page 32: ...32 Fig D21 Fig D22...
Page 33: ...33 Fig D23 8 3 13 Removal of the Hinge Cover LCD Case T Unit Fig D24 Fig D25...
Page 34: ...34 Fig D26 Fig D27 8 3 14 Removal of the LCD O Ring Fig D28...
Page 35: ...35 Fig D29 8 3 15 Removal of the LCD Panel Fig D30...
Page 36: ...36 Fig D31 8 3 16 Removal of the Mic Unit Monitor P C B Fig D32 Fig D33...
Page 37: ...37 Fig D34 8 3 17 Removal of the LCD Hinge Unit Fig D35...
Page 38: ...38 Fig D36 Fig D37...
Page 39: ...39 8 3 18 Removal of the Switch Unit Fig D38 Fig D39...
Page 42: ...42 10 Maintenance 10 1 Regular Maintenance Flow...
Page 43: ...43 10 2 Component Kits of Waterproof...
Page 49: ...Model No HX WA2 Schematic Diagram Note...
Page 50: ...Model No HX WA2 Parts List Note...
Page 51: ...Model No HX WA2 Main CAA Schematic Diagram Main P C B...
Page 52: ...Model No HX WA2 Main DMA Schematic Diagram Main P C B...
Page 53: ...Model No HX WA2 Main PWA Schematic Diagram Main P C B...
Page 54: ...Model No HX WA2 Main STA Schematic Diagram Main P C B...
Page 55: ...Model No HX WA2 Monitor Schematic Diagram Monitor P C B...
Page 56: ...Model No HX WA2 Main P C B Component Side...
Page 57: ...Model No HX WA2 Main P C B Foil Side...
Page 58: ...Model No HX WA2 Monitor P C B Component Side...
Page 59: ...Model No HX WA2 Monitor P C B Foil Side...
Page 66: ...Model No HX WA2 Frame and Casing Section 1...
Page 67: ...Model No HX WA2 Frame and Casing Section 2...
Page 68: ...Model No HX WA2 Packing Parts and Accessories Section...
