4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HC-V520P
Page 9: ...9 3 5 Formatting ...
Page 11: ...11 4 Specifications 4 1 For NTSC Areas ...
Page 12: ...12 ...
Page 13: ...13 ...
Page 14: ...14 ...
Page 15: ...15 ...
Page 16: ...16 4 2 For PAL Areas ...
Page 17: ...17 ...
Page 18: ...18 ...
Page 19: ...19 ...
Page 20: ...20 ...
Page 36: ...36 Fig D4 8 3 3 Removal of the Front Case Unit Fig D5 ...
Page 38: ...38 Fig D9 8 3 6 Removal of the Lens Unit Fig D10 ...
Page 39: ...39 8 3 7 Removal of the SD Holder P C B Main P C B Fig D11 Fig D12 ...
Page 40: ...40 8 3 8 Removal of the Monitor P C B Light Guide Plate Unit LCD Panel Unit Fig D13 Fig D14 ...
Page 41: ...41 Fig D15 Fig D16 ...
Page 43: ...43 8 3 11 Removal of the MOS Unit IR Cut Grass Fig D19 Fig D20 ...
Page 44: ...44 Fig D21 8 3 12 Removal of the Iris Unit Fig D22 ...
Page 45: ...45 Fig D23 8 3 13 Removal of the 2nd Stepping Moter 3rd Stepping Motor Focus Motor Fig D24 ...
Page 46: ...46 Fig D25 ...
Page 49: ...49 Level Shot Adjutment Chart ...
Page 50: ...50 9 1 2 Adjustment Items Adjustment item as follows ...
Page 53: ...53 ...
Page 54: ...54 ...
Page 55: ...55 ...
Page 56: ...56 ...
Page 57: ...57 ...
Page 58: ...58 ...
Page 59: ...59 ...