10
3.6.
Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
• Baking temperature and time (Hour)
80
°
C / 24 hour
Summary of Contents for HC-V520EB
Page 9: ...9 3 5 Formatting ...
Page 11: ...11 4 Specifications 4 1 For NTSC Areas ...
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Page 16: ...16 4 2 For PAL Areas ...
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Page 36: ...36 Fig D4 8 3 3 Removal of the Front Case Unit Fig D5 ...
Page 38: ...38 Fig D9 8 3 6 Removal of the Lens Unit Fig D10 ...
Page 39: ...39 8 3 7 Removal of the SD Holder P C B Main P C B Fig D11 Fig D12 ...
Page 40: ...40 8 3 8 Removal of the Monitor P C B Light Guide Plate Unit LCD Panel Unit Fig D13 Fig D14 ...
Page 41: ...41 Fig D15 Fig D16 ...
Page 43: ...43 8 3 11 Removal of the MOS Unit IR Cut Grass Fig D19 Fig D20 ...
Page 44: ...44 Fig D21 8 3 12 Removal of the Iris Unit Fig D22 ...
Page 45: ...45 Fig D23 8 3 13 Removal of the 2nd Stepping Moter 3rd Stepping Motor Focus Motor Fig D24 ...
Page 46: ...46 Fig D25 ...
Page 49: ...49 Level Shot Adjutment Chart ...
Page 50: ...50 9 1 2 Adjustment Items Adjustment item as follows ...
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