10
3.5.
Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
• Baking temperature and time (Hour)
80°C / 24 hour
Summary of Contents for HC-V260EE
Page 12: ...12 ...
Page 14: ...14 ...
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Page 25: ...25 8 2 PCB Location ...
Page 28: ...28 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Page 31: ...31 8 3 6 Removal of the Lens Frame Unit Fig D8 Fig D9 ...
Page 33: ...33 Fig D12 8 3 9 Removal of the Top Operation BATT Catcher P C B Fig D13 ...
Page 34: ...34 8 3 10 Removal of the R Frame Unit Speaker LCD Unit Fig D14 Fig D15 ...
Page 36: ...36 Fig D18 8 3 12 Removal of the Spring Holder Bar rier Lever Fig D19 ...
Page 38: ...38 8 3 15 Removal of the MOS Unit IR Cut Grass Fig D22 Fig D23 ...
Page 39: ...39 Fig D24 8 3 16 Removal of the 2nd Stepping Motor Fig D25 ...
Page 40: ...40 Fig D26 8 3 17 Removal of the 3rd Stepping Motor Fig D27 ...
Page 41: ...41 Fig D28 8 3 18 Removal of the Focus Motor Fig D29 ...
Page 42: ...42 Fig D30 ...
Page 46: ...46 9 1 2 Adjustment Items Adjustment item as follows ...
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