ESD Suppressor
・
Array / Packaging methods
●
Standard quantity
●
Carrier taping
Unit : mm
●
Taping reel
Unit : mm
Recommendations and precautions are described below
●
Recommended soldering conditions for reflow
For soldering (Example : Sn/Pb )
For lead-free soldering (Example : Sn/Ag/Cu )
・
Reflow soldering shall be performed a maximum of two times.
・
Please contact us for additional information when used in
conditions other than those specified.
· Please measure the temperature of the terminals and study
every kind of solder and printed circuit board for solderability
before actual use.
max. 260
℃
max. 10 s
150
℃
to 180
℃
60 s to 120 s
Above 230
℃
30 s to 40 s
30 s to 40 s
235 ± 5
℃
max. 10 s
Temperature
Time
Temperature
Time
140
℃
to 160
℃
60 s to 120 s
Part number
EZAEG1N
EZAEG2A,2N
EZAEG3A
EZAEG3W
EZAEGCA
0.70±0.05
1.08±0.10
0.85±0.05
Above 200
℃
+1.0
0
60.0
13.0±0.2
Dimensions
9.0
+1.0
0
11.4±1.0
5000
4000
5000
0603
0603
0805
0201
0402
0.38±0.05
0.70±0.05
8.00±0.20
3.50±0.05
1.75±0.10
1.10±0.10
0.91±0.10
1.55±0.15
0.68±0.05
1.20±0.05
1.90±0.10
1.82±0.10
2.30±0.20
2.00±0.10
4.00±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Apr-20
Single
Array
180.0
0
-1.5
W
1
W
2
øD
0
T
W
F
E
P
1
P
2
P
0
A
B
Size(inch)
+0.1
0
1.5
15000
0402
Packaging methods (Taping)
Part number
Size (inch)
Type
Kind of taping
Pitch (P
1
) (mm)
Quantity (pcs / reel)
2
10000
4
Punched carrier taping
Pressed carrier taping
EZAEG1N
EZAEG2A,2N
EZAEG3A
EZAEG3W
EZAEGCA
0201
0603
0603
0805
Dimensions
øA
øN
øC
2.00±0.05
4.00±0.10
0.42±0.05
0.60±0.05
Preheating
Main heating
Peak
Preheating
Main heating
Peak
Recommended soldering conditions
T
P
2
P
0
A
P
1
F
W
E
Pressed
carrier
T
Punched
carrier
B
(2 mm pitch)
P
1
Peak
Preheating
Heating
Time
Tem
per
at
ur
e
ø
D
0
ø
A
ø
C
øN
W
1
W
2
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