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Matters to Be Observed When Using This Product / Reference Information

 Soldering the resistor with too much solder or too little solder results in the poor reliability of the solder connection of the

resistor. Use the proper volume of solder in the soldering process. Sufficiently check for the volume of solder used.

 Soldering with high bond strength or special property solder may affect the quality of the resistor. Do not use such solder.

 Use rosin-based solder flux. When using highly active solder flux made mainly of halogen (chlorine, bromine, etc.), flux

residues may affect the performance and reliability of the resistor. Check the effects of flux residues before using the solder 
flux. Do not use highly acidic flux, water-soluble flux, or flux containing fluoride ions. When solder flux sticks to the resistor 
after the soldering process, the activation energy of the flux may corrode the resistor and cause it to fail. Prevent solder flux 
from sticking to the resistor.

Keeping the product in the following environments or conditions may lead to degradation of its performance, solderability, etc. 
Do not keep the product in the following environments.

(1) Stored in a place where the product is heavily exposed to sea breeze or a corrosive gas, such as Cl

2

, H

2

S, NH

3

, SO

2

,

or NO

X

.

(2) Stored in a place where the product is exposed to direct sunlight.
(3) Stored in a place where a temperature condition of 5 

 to 35 

 and a relative humidity condition of 45% to 85% cannot 

be maintained.

(4) Kept in storage for more than one year from the delivery date (when the product is kept in conditions excluding any of 

the environments (1) to (3)).

Before using the resistor, refer to the technical report issued by JEITA, EIAJ RCR-2121B "Safety Application Guide for 
Fixed Resistor for Use in Electronic Equipment" revised in February 2015.

30-Jun-23

 

Storage conditions

Reference information

 

Guidelines

Summary of Contents for EXB 14V Series

Page 1: ...oncave terminal 0602 8 1 Mar 20 Design and specifications are each subject to change without notice Ask factory for the current technical specifications before purchase and or use S8 34 Concave terminal Convex terminal Convex terminal Convex terminal Convex terminal 2H 0603 2 0603 4 Chip Resistors Array Features Explanation of part numbers 0402 4 24 28 38 N8 Thick film chip resistor networks Const...

Page 2: ... element Rated current Maximum overload current 1 EXB14V 0201 2 0 031 EXB18V 0201 4 EXB24V 0402 2 EXB28V 0402 4 0 031 0 1 W package 12 5 12 5 50 50 0 063 0 063 100 T C R 10 6 K Category temperature range 1 to 1 M 1 A 100 100 Design and specifications are each subject to change without notice Ask factory for the current technical specifications before purchase and or use Should a safety concern ari...

Page 3: ... 20 3 5 0 30 0 20 0 80 0 35 0 20 3 0 1 00 0 10 2 00 0 10 B Mass Weight Reference g 1000 pcs G 1 60 0 15 0 50 0 10 0 65 0 15 0 45 0 15 EXBV4V 0603 2 1 60 0 20 0 10 1 60 0 20 0 10 0 60 0 10 0 60 0 10 0 30 0 15 0 80 0 45 0 15 EXBN8V 0402 4 0 45 0 10 0 30 0 10 0 30 0 10 0 20 0 15 0 50 L W T A1 A2 0 55 0 15 30 Design and specifications are each subject to change without notice Ask factory for the curre...

Page 4: ...ure Resistance to soldering heat Overload T C R Resistance 1 1 2 Within specified T C R Within specified tolerance Dimensions not to scale Performance P G 1 40 0 10 0 35 0 10 0 20 0 10 0 60 0 10 Dimensions 0 20 0 10 0 10 0 10 0 40 0 20 0 10 L Mass Weight Reference g 1000 pcs Should a safety concern arise regarding this product please be sure to contact us immediately 1 Mar 20 Design and specificat...

Page 5: ...ed by UN numbers UN classifications etc does not apply to this product In addition when exporting products product specifications and technical information described in this catalog please comply with the laws and regulations of the countries to which the products are exported especially those concerning security export control Each model of this product complies with the RoHS Directive Restrictio...

Page 6: ...e printed board or a drying condition for drying the printed board after soldering the resistor is improper it may have a negative effect on the performance reliability of the resistor Confirming these conditions sufficiently is your own responsibility Also examine the effects of soiled cleaning agent cleaning residues and post cleaning contaminations and control for these effects properly When th...

Page 7: ...resistor has been soldered be careful that the board does not bend excessively If necessary provide the board with backup pins support pins to keep it straight Avoid manual board splitting Use a jig etc to break the board so that it does not bend excessively when split apart When the product is used under mounting conditions departing from mounting conditions specified in our specification sheet t...

Page 8: ...rocess the activation energy of the flux may corrode the resistor and cause it to fail Prevent solder flux from sticking to the resistor Keeping the product in the following environments or conditions may lead to degradation of its performance solderability etc Do not keep the product in the following environments 1 Stored in a place where the product is heavily exposed to sea breeze or a corrosiv...

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