Panasonic DVD-K32GCS, Service Manual

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1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your body by
touching a known earth ground. Alternatively, obtain and wear a
commercially available dischargingESD wrist strap, which should be
removed for potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES devices, place
the assembly on a conductive surface such as alminum foil, to prevent
electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder removal
devices not classified as "anti-static (ESD protected)" can generate
electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical
charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package
until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a
replacement ES device, touch the protective material to the chassis or
circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all
other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES
devices. (Otherwise hamless motion such as the brushing together of
your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity (ESD) sufficient todamage an ES device).
3. PRECAUTION OF LASER DIODE
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