Measure the high voltage. The high voltage should be 29.25 ± 1.25kV (for 27” and 32” models)
and 31.25 ± 1.25kV (for 36” models). If the upper limit is out of tolerance,immediate service and
correction is required to insure safe operation and to prevent the possibility of premature
component failure.
Horizontal oscillator disable circuit test
This test must be performed as a final check before the receiver is returned to the customer. See
horizontal oscillator disable circuit procedure check in this manual.
2. Service notes
NOTE
These components are affixed with glue. Be careful not to break or damage any foil under the
component or at the pins of the ICs when removing. Usually applying heat to the component for a
short time while twisting with tweezers will break the component loose.
Leadless chip component (surface mount)
Chip components must be replaced with identical chips due to critical foil track spacing. There
are no holes in the board to mount standard transistors or diodes. Some chips capacitor or
resistor board solder pads may have holes through the board,however the hole diameter limits
standard resistor replacement to 1/8 watt. Standard capacitor may also be limited for the same
reason. It is recommended that identical components be used.
Chip resistor have a three digit numerical resistance code, 1st and 2nd significant digits and a
multiplier. Example: 162 = 1600 or 1.6k resistor, 0 = 0 (jumper).
Chip capacitors generally do not have the value indicated on the capacitor. The color of the
component indicates the general range of the capacitance.
Chip transistors are identified by a two letter code. The first letter indicates the type and the
second letter, the grade of transistor.
Chip diodes have a two letter identification code as per the code chart and are a dual diode pack
with either common anode or common cathode. Check the parts list for correct diode number.
Component removal
1. Use solder wick to remove solder from component end caps or
terminal.
2. Without pulling up, carefully twist the component with tweezers to
break the adhesive.
3. Do not reuse removed leadless or chip components since they are
subject to stress fracture during removal.
Chip component installation
4
Summary of Contents for CT27E13G - 27" COLOR TV
Page 14: ...8 Location of controls remote 8 1 EUR7613Z60 14 ...
Page 38: ...14 1 1 C Board Chassis C Board component location 14 1 2 C Board Chassis 36 Models 38 ...
Page 39: ...14 1 3 Y Board Chassis 39 MC Service ...
Page 40: ...40 ...
Page 42: ...42 ...
Page 43: ...14 1 6 Y Board Surface mounted components Y Board bottom view 43 MC Service ...
Page 44: ...15 Reference for PDF Colors 44 ...
Page 46: ...46 ...
Page 47: ...18 2 Notas de Esquemáticos en Español 47 MC Service ...
Page 48: ...48 ...
Page 50: ...20 Parts List 20 1 Parts List Notes 20 2 Parts List 50 ...
Page 52: ...C350 ECA1CM101B CAP E 100UF 16V CT 27E13G CT 27E33G CT 32E13G CT 32E33G 52 ...
Page 61: ...Q953 2SC1741ASTP TRANSISTOR CT 36E33G CT 36E13G 61 MC Service ...
Page 63: ...R039 ERDS2TJ102T RES C 1K J 1 4W 63 MC Service ...
Page 82: ...1 2 3 4 5 6 7 8 A B C D E F G H I J C BOARD 1 of 2 TNP2AA157AM CT 36E13G CT 36E33G MC Service ...
Page 83: ...1 2 3 4 5 6 7 8 A B C D E F G H I J C BOARD 2 of 2 TNP2AA157AM CT 36E13G CT 36E33G MC Service ...
Page 86: ...1 2 3 4 5 6 7 8 A B C D E F G H I J C BOARD TNP2AA157 CT 36E13G CT 36E33G MC Service ...