Sockets for memor
y card
(AXA1)
SPECIFICATIONS
1. Characteristics (Complies with miniSD™ card and application note specification Ver. 1.0.)
2. Material and surface treatment
3. Applicable memory card and socket
DIMENSIONS
(Unit: mm)
Note: An indication, such as a logo, specified by the customer can be marked on the
SD logo-printed surface through a separate agreement on the specifications.
Item
Specifications
Condition
Electrical
characteristics
Rated current
0.5A/1 terminal
Contact resistance
Max. 100m
Ω
Measured based on the HP4338B measurement
method of JIS C 5402
Insulation resistance
Min. 1,000M
Ω
(Initial)
Using 500V DC megger (applied for 1 min.)
Breakdown voltage
500V AC for 1 min. (Initial)
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1 mA.
Mechanical
characteristics
Vibration resistance
No current interruption for more than 0.1
µ
s
Frequency: 10 to 2,000 Hz
Acceleration: 20.0 m/s
2
{2.0G}
Measured while mated with SD memory card socket
mounted on evaluation board.
Insertion and removal force of
miniSD™ card
Insertion force: Max. 40N {4.08kgf}
Removal force: Min. 1N {0.10kgf},
Max. 40N {4.08kgf}
Force required for insertion and removal of miniSD™
card to and from miniSD™ adapter.
Insertion and removal force of
adapter
Insertion force: Max. 40N {4.08kgf}
Removal force: Min. 1N {0.10kgf}, Max. 40N {4.08kgf}
Force required for insertion and removal into and out of
SD memory card socket with a miniSD™ card mated.
Lifetime
characteristics
Insertion and removal life of
miniSD™ card and adapter
Insertion and removal life: 10,000 times
Contact resistance after testing: Max. 100m
Ω
Insertion and removal speed are at a rate of 400 times/
hour or less.
Environment
characteristics
Ambient temperature
–25
°
C to +85
°
C
No freezing or condensation in low temperatures
Storage temperature
–40
°
C to +85
°
C
(The allowable storage temperature is –40
°
C to +50
°
C
if unopened from original packaging)
No freezing or condensation in low temperatures
Humidity tolerance (mated
condition)
Contact resistance: Max. 100m
Ω
Insulation resistance: Min. 100M
Ω
MIL-STD-1344A, METHOD 1002
Temperature: 40
±
2
°
C,
Humidity: 90 to 95%RH,
Test time: 500 hours
Unit weight
1.40g
Portion
Material
Surface
Signal contact
Copper alloy
Contact portion: Ni plating on base, PdNi + Au plating on surface
Memory card
Socket
Cards complying with miniSD™ card specification Ver. 1.02.
Sockets complying with SD memory card specification Ver. 2.0.
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://www.mew.co.jp/ac/e
CAD Data
3.5
°
Movable angle
1.4
±
0.15
22.5
0
–0.1
12.0
4.0
4.0
32.0
±
0.1
16.0
8.0
14.5
(15.85)
(9.95)
2.0
12.0
6.0
Area where logo, etc.,
can be printed
(0.02 mm recess)
5-R0.5
12.0
20.1
24.0
±
0.1
mini SD memory card
0.5
0.5
0.15
2.1
±
0.15
6
×
P2.5 = 15.0
2.425
Max.13.0
10.0
3-R1.0
Write abled
Write enabled
Part No./Country of origin/Lot
5.75
7.8
10.0
1.5
22.5
4.5
3.8
7.8
14.5
3.0
1.70
http://www.mew.co.jp/ac/e/
Matsushita Electric Works, Ltd.
