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C. Features
1. The TF 1000 System is lightweight and compact, with the placement
station and reflow station combined in one unit
2. Up to 40 reflow profiles can be stored by the TF 1000. Saved profiles
can be recalled at the touch of a button and are displayed on the LCD
display panel.
3. A colored LED indicates each phase of the reflow cycle so the status of
each operation can be easily seen and monitored.
4. Placement of small BGA/CSP is easily accomplished through the use
of microscope optics with image overlay.
5. A highly efficient, 700-watt topside heater used in conjunction with a
truly unique nozzle design insures the uniformity of the temperature
across the assembly.
6. The infrared bottom side heater with a wide heating area is
incorporated to prevent warping of the PCB, and to enhance the reflow
of BGA/CSP.
7. The blower and vacuum pumps are self-contained. No external air
supplies are required.
8. A cooling fan automatically activates at the end of the reflow cycle to
cool the component, PCB, and nozzle.
9. The TF 1000 is versatile and ensures repeatable results