4
Photomicrosensor (Transmissive)
EE-SX1107
Precautions
■
Soldering Information
Reflow soldering
•
The following soldering paste is recommended:
Melting temperature: 216 to 220
°
C
Composition: Sn 3.5 Ag 0.75 Cu
•
The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm.
•
Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered.
Manual soldering
•
Use “Sn 60” (60% tin and 40% lead) or solder with silver content.
•
Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 350
°
C or below.
•
Solder each point for a maximum of three seconds.
•
After soldering, allow the product to return to room temperature before handling it.
Storage
To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the
product under the following conditions:
Temperature: 10 to 30
°
C
Humidity: 60% max.
The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time
the product must be stored under 30
°
C at 80% maximum humidity.
If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope
was opened, bake the product under the following conditions before use:
Reel: 60
°
C for 24 hours or more
Bulk: 80
°
C for 4 hours or more
260
°
C max.
Time
120 sec
T
e
mper
ature
1 to 5
°
C/s
150 to 180
°
C
40 sec max.
10 sec max.
1 to 5
°
C/s
255
°
C max.
230
°
C max.
