DMTA-10045-01EN, Rev. E, August 2016
Chapter 6
138
Figure 6
‑
22 Materials — smaller disbonds using MIA technique
The following products are used in this procedure:
•
Honeycomb composite training standard: 25 mm (1 in.) thick, 3 and 6 ply CFRP
top skin, and 3 ply fiberglass bottom skin. Includes one 13 mm (0.5 in.) and one
25 mm (1 in.) disbond on each side. P/N: NEC-6433 [U8620490].
•
Cable for pitch-catch and MIA modes, 1.83 m (6 ft).
P/N: SBM-CPM-P11 [U8800058]
•
Right angle MIA probe, 13 mm (0.5 in.) tip. P/N: S-MP-3 [U8010011]
To set the initial BondMaster 600 configuration
1.
Connect the probe and the cable to the PROBE connector of the BondMaster 600.
2.
When prompted, press
CONTINUE
(A key) to accept the PowerLink probe
information.
If you are using a non-PowerLink probe, access the
APPL SELECT
menu (A key)
using the ADV SETUP menu key (
).
3.
Select the
Smaller Disbonds and Repair Identification
application, and then
press
to accept (see Figure 6-23 on page 139).
NOTE
Summary of Contents for BondMaster 600
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Page 10: ...DMTA 10045 01EN Rev E August 2016 List of Abbreviations x ...
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Page 28: ...DMTA 10045 01EN Rev E August 2016 Introduction 18 ...
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Page 78: ...DMTA 10045 01EN Rev E August 2016 Chapter 4 68 Figure 4 2 Crosshairs and the NULL point ...
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