TWR-SB0410-36EVB tower system platform
, Rev. 1.0
NXP Semiconductors
21
Board bill of materials
26
2
J5, J6
HDR_1X3
CON 1x5 USB MINI-B RA SHLD SKT SMT 0.8
MM SP 156HAU -- HIROSE
UX60-MB-5ST
27
2
J7, J9
HDR 1X2 TH
HDR 1x2 TH 100 MIL SP 339H AU 118L - HAR-
WIN INC
M20-9990245
28
1
J12
PCI EXPRESS
TOWER SYS-
TEM
CON 1X3 TB TH 3.81 MM SP 201H -- 138L +
TERM BLOCK PLUG 3.81 MM 3POS - SUBAS-
SEMBLY
210-80099, 211-79220
29
1
J13
HDR_2X10
CON 1X2 TB TH 3.81 MM SP 201H -- 138L +
TERM BLOCK PLUG 3.81 MM 2POS - SUBAS-
SEMBLY
210-8009, 210-80098
30
1
Q1
RJK0301DPB
TRANS NMOS PWR 24 A 30 V SO8 - Vishay
Technology
SI4156DY-T1-GE3
31
15
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8,
TP9, TP10, TP11,
TP12, TP13, TP14,
TP15
TEST POINT
WHITE
TEST POINT WHITE 40 MIL DRILL 180 MIL TH
109L
5002
32
1
SW1
SW SMT 4.0 MM FMS 0.1 A MAX 16 V MAX
ROHS COMPLIANT
7914J-1-000E
Notes
1.
NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While
NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.
2.
Do Not Populate
Table 9. Bill of materials
(1)
(continued)
Item
Qty
Schematic label
Value
Description
Part Number
Assy
opt
