NXP Semiconductors TDA8944J, Specification Sheet

Page: 18 / 22

NXP Semiconductors
TDA8944J
2 x 7 W stereo BTL audio amplifier
Product specification Rev. 02 — 14 February 2000 18 of 22
9397 750 06861 © NXP B.V. 2010. All rights reserved.
18. Revision history
Table 11: Revision history
Rev Date CPCN Description
02 000214 - Product specification; second version; supersedes initial version TDA8944J-01 of
14 April 1999 (9397 750 04881). Modifications:
•
Table 1 on page 1 : SVRR; Typ value 65 dB
→
added
•
Figure 1 on page 2 : Block diagram; pin numbers changed OUT2
− →
14 and OUT2+
→
17
•
Figure 2 on page 3 : Pin configuration; pin numbers changed OUT2
− →
14 and OUT2+
→
17
•
Section 8 “Functional description” :
– Section 8.1 “Input configuration” on page 4
→
added.
– Section 8.2 “Power amplifier” on page 5 : ........, capable of delivering a peak output
current of 1.5 A
→
changed to 2 A.
– Section 8.2.1 “Output power measurement” on page 5
→
added
– Section 8.2.2 “Headroom” on page 5
→
added
•
Section 8.3 “Mode selection” :
– Standby mode: V
MODE
> (V
CC
−
0.5 V)
→
changed to (V
CC
−
0.5 V) < V
MODE
< V
CC
; The
power consumption of the
TDA8944J
will be reduced to <0.18 mW
→
added.
– Mute mode: the DC level of the input and output pins remain on half the supply
voltage
→
added;
– 2.5 V < V
MODE
< (V
CC
−
1.5 V)
→
changed to 3 V < V
MODE
< (V
CC
−
1.5 V)
– Section 8.3.1 “Switch-on and switch-off” on page 6
•
Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6
→
added
•
Section 8.5 “Built-in protection circuits” on page 6
→
added
•
Table 5 on page 7 :
– P
tot
value added 18 V
– V
CC(sc)
value added 15 V
•
Table 6 on page 7 :
– R
th(j-a)
value added 40 K/W
– R
th(j-c)
value 10
→
changed to 6.9 K/W; condition ‘in free air’
→
changed to ‘both channels
driven’
•
Table 7 on page 7 : V
MODE
- mute mode - value Min 2.5
→
changed to 3 V
•
Table 8 on page 8 :
– SVRR; Typ values 65 and 60 dB
→
added
–
α
cs
; Typ value 75 dB
→
added
•
Figure 3 to 13 : figures added
•
Section 13 “Internal circuitry” on page 12 :
→
added
•
Figure 14 : figure adjusted
•
Section 14.1 “Printed-circuit board (PCB)” on page 13 :
→
added
•
Figure 15 : figure added
•
Section 14.2 “Thermal behaviour and heatsink calculation” on page 15 :
→
added
•
Section 15.2 “Test conditions” on page 15 :
→
added
01 990414 - Preliminary specification; initial version.