
• Length — As short as possible. Trace length must be less than 300 mm. To optimize signal strength, minimize trace
length from TSI pins to touch pads.
• Clearance — To ensure signal integrity, leave a minimum clearance of 10 mils for the lines that run parallel to each other in the
same layer, and route perpendicularly the ones running in adjacent layers. Good design practice is to keep traces separated
by as much as the design allows. At the end of the sensor, where typically the pitch is lower than 10 mils, a bottleneck mode
connection is recommended as shown in
.
is an example for maintaining adequate clearance in touch
sensing traces.
Figure 26. PCB trace routing
• Avoid routing under touch electrode: Do not route traces directly under any touch pad. Avoid electrical noise to be
capacitive coupled to the electrodes.
• There must be no components near the touch electrodes.
• Better to routing under the bottom layer of PCB, to avoid impact of fingers.
• Avoid crossover with other signals.
• For the mutual mode key, keep the TX trace as far as possible from the RX trace.
5.3 Ground plane
A proper ground plane prevents the coupling of external electromagnetic interference to the touch sensing electrodes. It also
acts as a shield for undesired electric fields. X-hatch pattern ground is recommended instead of solid filled ground to use around
and under touch electrodes. This pattern can decrease the parasitic capacitance and increase the sensitivity of the touch sensor.
When there is enough space between electrodes, it is recommended to use X-hatch pattern between the electrodes. This provides
additional noise shielding and reference.
Following are a few recommendations and best practices for ground planes usage.
• Use X-hatch pattern on the top layer, 25 % ground fill, 7 mil line, 45 mil spacing.
• Use X-hatch pattern on the bottom layer (for example, underneath the electrodes area), 17 % ground fill, 7 mil line, 70 mil
spacing.
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KE17Z Dual TSI User Guide, Rev. 0, 05 May 2022
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