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CBT3126_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 23 October 2008
10 of 15
NXP Semiconductors
CBT3126
Quad FET bus switch
Fig 10. Package outline SOT519-1 (SSOP16)
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
e
H
E
L
L
p
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
5.0
4.8
4.0
3.8
0.635
1
6.2
5.8
0.89
0.41
0.18
0.05
8
0
o
o
0.18
0.2
0.09
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
SOT519-1
99-05-04
03-02-18
(1)
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
8
16
9
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
0
2.5
5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
A
max.
1.73