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NXP Semiconductors

BGA6489

MMIC wideband medium power amplifier

© NXP B.V. 2009.

All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

Date of release: 15 June 2009

Document identifier: BGA6489_2

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

14. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .  1

1.1

General description. . . . . . . . . . . . . . . . . . . . . .  1

1.2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1

1.3

Applications  . . . . . . . . . . . . . . . . . . . . . . . . . . .  1

1.4

Quick reference data. . . . . . . . . . . . . . . . . . . . .  2

2

Pinning information . . . . . . . . . . . . . . . . . . . . . .  2

3

Ordering information . . . . . . . . . . . . . . . . . . . . .  2

4

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2

5

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  3

6

Thermal characteristics. . . . . . . . . . . . . . . . . . .  3

7

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .  3

8

Application information. . . . . . . . . . . . . . . . . . .  7

8.1

Scattering parameters  . . . . . . . . . . . . . . . . . . .  8

9

Package outline . . . . . . . . . . . . . . . . . . . . . . . .  10

10

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .  11

11

Revision history . . . . . . . . . . . . . . . . . . . . . . . .  11

12

Legal information. . . . . . . . . . . . . . . . . . . . . . .  12

12.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . .  12

12.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12

12.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .  12

12.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . .  12

13

Contact information. . . . . . . . . . . . . . . . . . . . .  12

14

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13

Summary of Contents for BGA6489

Page 1: ...atures n Broadband 50 gain block n 20 dBm output power n SOT89 package n Single supply voltage needed 1 3 Applications n Broadband medium power gain blocks n Small signal high linearity amplifiers n V...

Page 2: ...1 V IS DC supply current VS 8 V R1 39 Tj 25 C 78 mA s21 2 insertion power gain f 1950 MHz 16 dB NF noise figure f 1950 MHz 3 3 dB PL1dB load power at 1 dB gain compression f 850 MHz 20 dBm f 1950 MHz...

Page 3: ...sp 70 C 1 800 mW Tstg storage temperature 65 150 C Tj junction temperature 150 C PD maximum drive power 15 dBm Table 6 Thermal characteristics Symbol Parameter Conditions Typ Unit Rth j sp thermal res...

Page 4: ...m IP3 in input intercept point f 850 MHz 13 dBm f 2500 MHz 12 dBm IP3 out output intercept point f 850 MHz 33 dBm f 2500 MHz 27 dBm IS 78 mA VS 8 V PD 30 dBm ZO 50 Fig 1 Input reflection coefficient s...

Page 5: ...1 90 90 5 0 5 0 2 0 2 0 2 5 5 2 0 2 0 5 0 5 1 1 2 1 10 0 0 2 0 6 0 4 0 8 1 0 1 0 45 135 45 135 180 0 2 6 GHz 200 MHz IS 78 mA VS 8 V PD 30 dBm ZO 50 IS 78 mA VS 8 V PD 30 dBm ZO 50 Fig 3 Insertion pow...

Page 6: ...put intercept as a function of frequency typical values PL1dB dBm 0 1500 500 2000 2500 f MHz 1000 0 25 15 20 5 10 mgx404 mgx405 IP3 out dBm 0 40 30 10 20 0 1500 500 2000 2500 f MHz 1000 IS 78 mA VS 8...

Page 7: ...edance Capacitor C4 is a supply decoupling capacitor A 1 F capacitor C5 can be added for optimum supply decoupling The external components should be placed as close as possible to the MMIC When using...

Page 8: ...35 38 1 1 400 0 11 21 64 12 31 149 28 0 06 0 35 0 14 46 54 1 1 500 0 12 15 28 11 97 141 88 0 06 0 32 0 14 57 20 1 1 600 0 14 8 01 11 57 134 79 0 06 0 04 0 15 61 41 1 1 700 0 16 0 34 11 18 127 97 0 06...

Page 9: ...154 47 5 08 30 28 0 08 15 56 0 31 97 10 1 3 2900 0 11 164 40 4 71 22 43 0 09 11 60 0 28 91 75 1 3 3000 0 11 178 65 4 66 18 90 0 09 11 05 0 31 84 80 1 3 3100 0 12 160 01 4 45 18 63 0 10 10 63 0 33 80 3...

Page 10: ...OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA DIMENSIONS mm are the original dimensions SOT89 TO 243 SC 62 06 03 16 06 08 29 w M e1 e E HE B B 0 2 4 mm scale bp3 bp2 bp1 c D Lp A Plas...

Page 11: ...e date Data sheet status Change notice Supersedes BGA6489_2 20090615 Product data sheet BGA6489_1 Modifications The format of this data sheet has been redesigned to comply with the new identity guidel...

Page 12: ...ductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Application...

Page 13: ...herein have been included in section Legal information 14 Contents 1 Product profile 1 1 1 General description 1 1 2 Features 1 1 3 Applications 1 1 4 Quick reference data 2 2 Pinning information 2 3...

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