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BGA6489_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 15 June 2009

7 of 13

NXP Semiconductors

BGA6489

MMIC wideband medium power amplifier

8.

Application information

Figure 10

 shows a typical application circuit for the BGA6489 MMIC. The device is

internally matched to 50

 and therefore does not require any external matching. The

value of the input and output DC blocking capacitors C1 and C2 depends on the operating
frequency; see

Table 9

. Capacitors C1 and C2 are used in conjunction with L1 and C3 to

fine tune the input and output impedance. Capacitor C4 is a supply decoupling capacitor.
A 1

µ

F capacitor (C5) can be added for optimum supply decoupling. The external

components should be placed as close as possible to the MMIC. When using via holes,
use multiple via holes per pin in order to limit ground path induction. Resistor R1 is a bias
resistor providing DC current stability with temperature.

V

S

 = 8 V; R

bias

= 39

.

Fig 9.

Supply current as function of operating junction temperature; typical values

I

s

(mA)

40

40

20

0

60

80

T

j

 (

°

C)

20

60

100

90

70

80

mgx408

(1) Optional capacitor for optimum supply decoupling.

(2) R1 values at operating supply voltage:

V

S

 = 6 V; R1 = 27

.

V

S

 = 8 V; R1 = 39

.

V

S

 = 11 V; R1 = 82

.

Fig 10. Typical application circuit

50 

microstrip

C1

C2

C3

L1

V

S

50 

microstrip

C4

C5(1)

R1(2)

mgx419

1

V

D

2

3

Summary of Contents for BGA6489

Page 1: ...atures n Broadband 50 gain block n 20 dBm output power n SOT89 package n Single supply voltage needed 1 3 Applications n Broadband medium power gain blocks n Small signal high linearity amplifiers n V...

Page 2: ...1 V IS DC supply current VS 8 V R1 39 Tj 25 C 78 mA s21 2 insertion power gain f 1950 MHz 16 dB NF noise figure f 1950 MHz 3 3 dB PL1dB load power at 1 dB gain compression f 850 MHz 20 dBm f 1950 MHz...

Page 3: ...sp 70 C 1 800 mW Tstg storage temperature 65 150 C Tj junction temperature 150 C PD maximum drive power 15 dBm Table 6 Thermal characteristics Symbol Parameter Conditions Typ Unit Rth j sp thermal res...

Page 4: ...m IP3 in input intercept point f 850 MHz 13 dBm f 2500 MHz 12 dBm IP3 out output intercept point f 850 MHz 33 dBm f 2500 MHz 27 dBm IS 78 mA VS 8 V PD 30 dBm ZO 50 Fig 1 Input reflection coefficient s...

Page 5: ...1 90 90 5 0 5 0 2 0 2 0 2 5 5 2 0 2 0 5 0 5 1 1 2 1 10 0 0 2 0 6 0 4 0 8 1 0 1 0 45 135 45 135 180 0 2 6 GHz 200 MHz IS 78 mA VS 8 V PD 30 dBm ZO 50 IS 78 mA VS 8 V PD 30 dBm ZO 50 Fig 3 Insertion pow...

Page 6: ...put intercept as a function of frequency typical values PL1dB dBm 0 1500 500 2000 2500 f MHz 1000 0 25 15 20 5 10 mgx404 mgx405 IP3 out dBm 0 40 30 10 20 0 1500 500 2000 2500 f MHz 1000 IS 78 mA VS 8...

Page 7: ...edance Capacitor C4 is a supply decoupling capacitor A 1 F capacitor C5 can be added for optimum supply decoupling The external components should be placed as close as possible to the MMIC When using...

Page 8: ...35 38 1 1 400 0 11 21 64 12 31 149 28 0 06 0 35 0 14 46 54 1 1 500 0 12 15 28 11 97 141 88 0 06 0 32 0 14 57 20 1 1 600 0 14 8 01 11 57 134 79 0 06 0 04 0 15 61 41 1 1 700 0 16 0 34 11 18 127 97 0 06...

Page 9: ...154 47 5 08 30 28 0 08 15 56 0 31 97 10 1 3 2900 0 11 164 40 4 71 22 43 0 09 11 60 0 28 91 75 1 3 3000 0 11 178 65 4 66 18 90 0 09 11 05 0 31 84 80 1 3 3100 0 12 160 01 4 45 18 63 0 10 10 63 0 33 80 3...

Page 10: ...OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA DIMENSIONS mm are the original dimensions SOT89 TO 243 SC 62 06 03 16 06 08 29 w M e1 e E HE B B 0 2 4 mm scale bp3 bp2 bp1 c D Lp A Plas...

Page 11: ...e date Data sheet status Change notice Supersedes BGA6489_2 20090615 Product data sheet BGA6489_1 Modifications The format of this data sheet has been redesigned to comply with the new identity guidel...

Page 12: ...ductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Application...

Page 13: ...herein have been included in section Legal information 14 Contents 1 Product profile 1 1 1 General description 1 1 2 Features 1 1 3 Applications 1 1 4 Quick reference data 2 2 Pinning information 2 3...

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