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2010 Sep 13

11

 

NXP Semiconductors

Product specification

Silicon MMIC amplifier

BGA2003

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published 

and may differ in case of multiple devices. The latest product status information is available on the Internet at 
URL http://www.nxp.com. 

DOCUMENT

STATUS

(1)

PRODUCT 
STATUS

(2)

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product 
development. 

Preliminary data sheet

Qualification

This document contains data from the preliminary specification. 

Product data sheet

Production

This document contains the product specification. 

DISCLAIMERS

Limited warranty and liability

 

 Information in this 

document is believed to be accurate and reliable. 
However, NXP Semiconductors does not give any 
representations or warranties, expressed or implied, as to 
the accuracy or completeness of such information and 
shall have no liability for the consequences of use of such 
information. 

In no event shall NXP Semiconductors be liable for any 
indirect, incidental, punitive, special or consequential 
damages (including - without limitation - lost profits, lost 
savings, business interruption, costs related to the 
removal or replacement of any products or rework 
charges) whether or not such damages are based on tort 
(including negligence), warranty, breach of contract or any 
other legal theory. 

Notwithstanding any damages that customer might incur 
for any reason whatsoever, NXP Semiconductors’ 
aggregate and cumulative liability towards customer for 
the products described herein shall be limited in 
accordance with the 

Terms and conditions of commercial 

sale

 of NXP Semiconductors.

Right to make changes

 

 NXP Semiconductors 

reserves the right to make changes to information 
published in this document, including without limitation 
specifications and product descriptions, at any time and 
without notice. This document supersedes and replaces all 
information supplied prior to the publication hereof.

Suitability for use

 

 NXP Semiconductors products are 

not designed, authorized or warranted to be suitable for 
use in life support, life-critical or safety-critical systems or 
equipment, nor in applications where failure or malfunction 
of an NXP Semiconductors product can reasonably be 
expected to result in personal injury, death or severe 

property or environmental damage. NXP Semiconductors 
accepts no liability for inclusion and/or use of NXP 
Semiconductors products in such equipment or 
applications and therefore such inclusion and/or use is at 
the customer’s own risk.

Applications

 

 Applications that are described herein for 

any of these products are for illustrative purposes only. 
NXP Semiconductors makes no representation or 
warranty that such applications will be suitable for the 
specified use without further testing or modification. 

Customers are responsible for the design and operation of 
their applications and products using NXP 
Semiconductors products, and NXP Semiconductors 
accepts no liability for any assistance with applications or 
customer product design. It is customer’s sole 
responsibility to determine whether the NXP 
Semiconductors product is suitable and fit for the 
customer’s applications and products planned, as well as 
for the planned application and use of customer’s third 
party customer(s). Customers should provide appropriate 
design and operating safeguards to minimize the risks 
associated with their applications and products. 

NXP Semiconductors does not accept any liability related 
to any default, damage, costs or problem which is based 
on any weakness or default in the customer’s applications 
or products, or the application or use by customer’s third 
party customer(s). Customer is responsible for doing all 
necessary testing for the customer’s applications and 
products using NXP Semiconductors products in order to 
avoid a default of the applications and the products or of 
the application or use by customer’s third party 
customer(s). NXP does not accept any liability in this 
respect.

Summary of Contents for BGA2003

Page 1: ...DATA SHEET Product specification Supersedes data of 1999 Jul 23 2010 Sep 13 DISCRETE SEMICONDUCTORS BGA2003 Silicon MMIC amplifier M3D124...

Page 2: ...sting of an NPN double polysilicon transistor with integrated biasing for low voltage applications in a plastic 4 pin SOT343R package PINNING PIN DESCRIPTION 1 GND 2 RF in 3 CTRL bias current control...

Page 3: ...ure 150 C SYMBOL PARAMETER VALUE UNIT Rth j s thermal resistance from junction to soldering point 350 K W SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT IS supply current VVS OUT 2 5 V ICTRL 0 4 mA 3 4...

Page 4: ...lfpage 0 50 100 200 200 150 50 0 100 MGS537 150 Ts C Ptot mW Fig 3 Power derating handbook halfpage 0 0 5 1 2 2 5 0 2 MGS538 1 5 1 5 1 0 5 VCTRL V ICTRL mA Fig 4 Control current as a function of the c...

Page 5: ...ameter typical values handbook halfpage 0 20 10 15 5 0 1 5 MGS541 2 3 4 VVS OUT V IVS OUT mA Fig 7 Bias current IVS OUT as a function of the voltage at the output pin VVS OUT typical values ICTRL 1 mA...

Page 6: ...OUT typical values VVS OUT 2 5 V f 1800 MHz handbook halfpage 0 MGS545 102 103 104 10 20 30 40 gain dB f MHz MSG Gmax GUM Fig 11 Gain as a function of frequency typical values VVS OUT 2 5 V IVS OUT 10...

Page 7: ...n circles typical values f 900 MHz VVS OUT 2 5 V IVS OUT 10 mA Zo 50 1 G 23 dB 2 G 22 dB 3 G 21 dB 4 NF 1 8 dB 5 NF 2 dB 6 NF 2 2 dB handbook full pagewidth MGS548 0 0 2 0 6 0 4 0 8 1 0 1 0 5 2 1 0 5...

Page 8: ...90 45 0 45 90 135 100 MHz 200 MHz 500 MHz 1 GHz 2 GHz 3 GHz Fig 15 Common emitter input reflection coefficient s11 typical values VVS OUT 2 5 V IVS OUT 10 mA Zo 50 handbook full pagewidth MGS550 20 1...

Page 9: ...Common emitter reverse transmission coefficient s12 typical values VVS OUT 2 5 V IVS OUT 10 mA Zo 50 handbook full pagewidth MGS552 0 0 2 0 6 0 4 0 8 1 0 1 0 5 2 1 0 5 0 2 0 0 2 0 5 1 2 5 0 2 0 5 1 2...

Page 10: ...EIAJ SOT343R D A A1 Lp Q detail X c HE E v M A A B 0 1 2 mm scale X 2 1 4 3 Plastic surface mounted package reverse pinning 4 leads SOT343R w M B 97 05 21 06 03 16 bp UNIT A1 max bp c D E b1 HE Lp Q w...

Page 11: ...ns and product descriptions at any time and without notice This document supersedes and replaces all information supplied prior to the publication hereof Suitability for use NXP Semiconductors product...

Page 12: ...s or other industrial or intellectual property rights Export control This document as well as the item s described herein may be subject to export control regulations Export might require a prior auth...

Page 13: ...in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any conseq...

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