NXP Semiconductors A3M39SL039, Datasheet

Page: 15 / 33

Temperature sensor
A3M39SL039 Airfast Power Amplifier Module with Autobias Control, Rev. 0, March 2022
Data Sheet: Technical Data 15 / 33
7.2 Component designations and values
Table 14. A3M39SL039 reference circuit component designations and values
Part Description Part Number Manufacturer
B1 30 Ω Ferrite Bead BLM15PD300SN1 Murata
C1, C2, C14, C15 10 µF Chip Capacitor GRM31CR61H106KA12 Murata
C4, C10, C12 1 µF Chip Capacitor GRM188R61H105KAAL Murata
C17 1000 pF Chip Capacitor GRM022R71A102KA12L Murata
C18 220 µF, 50 V Electrolytic Capacitor UUJ1H221MNQ1MS Nichicon
L1 13 nH Chip Inductor LQW15AN13NG80D Murata
Q1 Power Amplifier Module A3M39SL039 NXP
R1 0 Ω, 1/8 W Chip Resistor CRCW08050000Z0EA Vishay
PCB Rogers RO4350B, 0.020 ″, ε
r
= 3.66 D139037 MTL
Note: Component numbers C3, C5, C6, C7, C8, C9, C11, C13 and C16 are intentionally omitted.
8 Temperature sensor
The temperature value is converted from the 8-bit temperature sense ADC value (stored in the Temp_ADC register) via the
following equation.
Temperature (°C) = (0.67798 × Temp_ADC) – 36.64
A plot of this equation is shown in
Figure 4 .
Figure 4. Die temperature versus ADC code
Table 15. Temperature sensor accuracy
Characteristic Value Unit
Operating Die Temperature, T
J
= 25°C to 125°C ±3 °C
Operating Die Temperature, T
J
= –35°C to 125°C ±5 °C
DI
E
TE
M
PE
RA
TUR
E
(
C)
ADC CODE (DECIMAL)
140
100
60
80
40
20
0
–20
256 0 64 32 112 160 208
–60
–40
120
16 48 96 128 192 224 240
160
80 176 144