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CCS Technical Documentation

System Module

RH-41

Issue 2 09/2003

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Nokia Corporation Confidential

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Summary of Contents for RH-41 Series

Page 1: ...CCS Technical Documentation RH 41 Series Transceivers Issue 2 09 2003 Confidential Nokia Corporation System Module ...

Page 2: ...RH 41 System Module CCS Technical Documentation Page 2 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 3: ...on to UEM 12 Regulators 12 RF Interface 13 Charging Control 13 Digital Interface 13 Audio Codec 14 UI Drivers 14 AD Converters 14 UPP 14 Introduction 14 Blocks 14 Flash Memory 15 Introduction 15 User Interface Hardware 15 LCD 15 Introduction 15 Interface 15 Keyboard 15 Introduction 15 Power Key 16 Keys 16 Lights 17 Introduction 17 Interfaces 17 Technical Information 17 Audio HW 17 Earpiece 17 Intr...

Page 4: ...nd Control IO Line Protection 23 Keyboard lines 23 C Cover 23 PWB 23 LCD 23 Microphone 23 EARP 23 Buzzer 23 System Connector Lines 24 Battery Connector Lines 24 MBUS and FBUS 24 Transceiver Interfaces 24 BB RF Interface Connections 24 BB Internal Connections 28 UPP Block Signals 33 Memory Block Interfaces 37 Audio Interfaces 38 Key Display blocks 40 Keyboard Interface 40 Display Interface 40 RF Mo...

Page 5: ...dule RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 5 TDMA 1900 MHz Front End 46 Frequency Synthesizers 48 Transmitter 49 Common IF 49 Cellular Band 49 PCS Band 49 Power Control 50 Antenna Circuit 50 RF Performance 50 Antenna 51 ...

Page 6: ...RH 41 System Module CCS Technical Documentation Page 6 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 7: ...itched Data CSP Chipped Scale Package The same as uBGA CTIA Cellular Telecommunications Industry Association D A Digital to Analog conversion DCCH Digital Control Channel DSP Digital Signal Processing DTCH Digital Traffic Channel EFR Enhanced Full Rate codec FCC Federal Communications Commission IrDA Infrared Data Association IrMC Infrared Mobile Communications IrOBEX IrDA Object Exchange Protocol...

Page 8: ... Modulation RF Radio Frequency SAR Specific Absorption Rate SCF Software Component Factory SMD Surface Mount Device SMS Short Message Service SPR Standard Product Requirement TDD Text Device for the Deaf TDMA Time Division Multiple Access Here US digital cellular system TIA Telecommunications Industry Association TTY Teletype UEM Universal Energy Management a Baseband ASIC UPP Universal Phone Proc...

Page 9: ...r consists of the engine module ST6_11 and the various assembly parts The transceiver has a full graphic display and the user interface is based on a Jack style UI with two soft keys An internal antenna is used in the phone and there is no connec tion to an external antenna The transceiver also has a low leakage tolerant earpiece and an omnidirectional microphone that provides excellent audio qual...

Page 10: ...nel DTCH Digital Traffic Channel Digital Data Channel DDCH Both the analog and digital modes have different states controlled by the Cellular SW Some examples are Idle State on ACCH Camping on DCCH Scanning Conversation NSPS No Service Power Save previously OOR Out of Range 3 Local mode both Cellular SW and UI SW non active 4 Test mode Cellular SW active but UI SW non active Environmental Specific...

Page 11: ...ngine Module Baseband Module The core part of the transceiver s baseband see the figure below consists of two ASICs the UEM and UPP and flash memory The following sections illustrate and explain these parts in detail Figure 2 System Block Diagram UEM UPP EAR MIC BUZZER RF Supplies BATTERY PA supply LCD CBUS DBUS BB Supplies SLEEPCLOCK 32kHz FLASH 16Mbit MEMADDA MEMCONT RF IC RFCLK 19 44MHz BASEBAN...

Page 12: ...gulators require external 1uF capacitors Vref25RF is the refer ence voltage for the VR2 regulator Vref25BB is the reference voltage for the VANA VFLASH1 VFLASH2 VR1 regulators Vref278 is the reference voltage for the VR3 VR4 VR5 VR6 VR7 regulators and VrefRF01 is the reference voltage for the VIO VCORE reg ulators and for the radio frequency RF The VANA regulator supplies the baseband s BB interna...

Page 13: ...ator supplies the higher band PA and TX amplifier In light load situations the VR6 regulator can be set to the low Iq mode The VR7 regulator supplies the VCO and Taco In light load situations the VR7 regulator can be set to the low Iq mode The IPA1 and IPA2 are programmable current generators A 27Ω 1 100ppm external resistor is used to improve the accuracy of the output current The IPA1 is used by...

Page 14: ...r for the buzzer display and keyboard LEDs inside the UEM These generate PWM square wave for the various devices AD Converters The UEM is equipped with an 11 channel analog to digital converter Some AD converter channels LS KEYB1 2 are not used in RH 41 The AD converters are calibrated in the production line UPP Introduction RH 41 uses the UPPv4M ASIC The RAM size is 4M The processor architecture ...

Page 15: ...erface Hardware LCD Introduction RH 41 uses a black and white GD46 84x48 full dot matrix graphical display The LCD module includes the LCD glass the LCD COG driver an elastomer connector and a metal frame The LCD module is included in the lightguide assembly module Interface The LCD is controlled by the UI SW and the control signals are from the UPP ASIC The VIO and Vflash1 regulators supply the L...

Page 16: ... Keys Other keys are detected so that when a key is pressed down the metal dome connects one S line and one R line of the UPP together and creates an interrupt for the SW This kind of detection is also known as metaldome detection The matrix of how lines are con nected and which lines are used for different keys is described in the following table The S line S0 and R line R5 are not used at all wh...

Page 17: ...s are soldered on the component side of the module PWB The LEDs have a white plastic body around the diode and this directs the emitted light better to the UI side The current for the LCD and keyboard lights is limited by the resistor between the Vbatt and LEDs Audio HW Earpiece Introduction The speaker is a dynamic one It is very sensitive and capable of producing relatively high sound pressure a...

Page 18: ...sistor measures the battery temperature Temperature and capacity information is needed for charge control These resistors are connected to BSI and BTEMP pins of the battery connector The phone has pull up resistors for these lines so that they can be read by A D inputs in the phone see the figure below Serial resistors in the BSI and BTEMP lines are for ESD protection Both lines also have spark ca...

Page 19: ...tion RH 41 uses accessories via a system connector Interface The interface is supported by fully differential 4 wire XMICN XMICP XEARN and XEARP accessories RH 41 supports the HDE 2 inbox headset HDB 5 Boom headset HDC 5 headset LPS 3 loopset and the PPH 1 car kit Signal name Connected from to Batt I O Signal properties A D levels freq timing Description Notes 1 VBAT batt VBAT I O Vbat 3 0 5 1V Ba...

Page 20: ...he HOOKINT line is used to determine which accessory is connected This is done by the voltage divider which consists of the phone s internal pull up and accessory spe cific pull down The voltage generated by this divider is then read by the ad converter of UEM The HOOKINT interrupt is generated by the button in the headset or by the acces sory external audio input Figure 7 Accessory Detection Exte...

Page 21: ...connection is implemented through the system connector The system con nector supports charging with both plug chargers and desktop stand chargers There are three signals for charging The charger GND pin is used for both desktop and plug chargers as well as for charger voltage The PWM control line which is needed for 3 wire chargers is connected directly to the GND in the PWB module so the RH 41 en...

Page 22: ... are CSP components the visibility of BB signals is very poor This makes the measuring of most of the BB signals impossible In order to debug the BB at least to some level the most important signals can be accessed from the 0 6 mm test points The figure below shows the test points located between the UEM and the UPP There is an opening in the baseband shield to provide access to these pads Figure ...

Page 23: ... distance from A cover to PWB is made longer with the spikes in the keymat together with C cover metallization is protecting keyboard lines C Cover The C cover on the UI side is metallized on the inner surface partly and is grounded All areas in which the plated C cover touches the PWB surface are grounded and the solder masks are opened PWB All edges are grounded on both sides of the PWB and the ...

Page 24: ...ections illustrate the signals between the various transceiver blocks BB RF Interface Connections The BB and RF parts are connected together without a physical connector All the signal descriptions and properties in the following tables are valid only for active signals and the signals are not necessarily present all the time Note In the following tables the nominal signal level of 2 78V is someti...

Page 25: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 25 ...

Page 26: ...RH 41 System Module CCS Technical Documentation Page 26 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 27: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 27 ...

Page 28: ...RH 41 System Module CCS Technical Documentation Page 28 Nokia Corporation Confidential Issue 2 09 2003 BB Internal Connections ...

Page 29: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 29 ...

Page 30: ...RH 41 System Module CCS Technical Documentation Page 30 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 31: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 31 ...

Page 32: ...RH 41 System Module CCS Technical Documentation Page 32 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 33: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 33 UPP Block Signals ...

Page 34: ...RH 41 System Module CCS Technical Documentation Page 34 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 35: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 35 ...

Page 36: ...RH 41 System Module CCS Technical Documentation Page 36 Nokia Corporation Confidential Issue 2 09 2003 ...

Page 37: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 37 Memory Block Interfaces ...

Page 38: ...RH 41 System Module CCS Technical Documentation Page 38 Nokia Corporation Confidential Issue 2 09 2003 Audio Interfaces ...

Page 39: ...CCS Technical Documentation System Module RH 41 Issue 2 09 2003 Nokia Corporation Confidential Page 39 ...

Page 40: ...the following systems AMPS TDMA 800 TDMA 1900 The minimum transceiver performance requirements are described in TIA EIA 136 270 The RH 41 RF must follow the requirements in the revision A The EMC requirements are set by FCC 47CFR 15 107 conducted emissions 15 109 radiated emissions idle mode and 22 917 radiated emissions call mode The dualband RF module is capable of seamless operation between the...

Page 41: ...e multiwall RF shield is used and this sets the maximum component height to 2 0 mm An internal antenna is located on the top of the phone and there is room for a 4 0 mm high ceramic duplexer under the antenna assembly Software Compensations The following software compensations are required Power levels temperature compensation Power levels channel compensation Power level reduction due to low batt...

Page 42: ...ics Power Distribution Diagram Note The current values in the following figure are not absolute values and cannot be measured These values represent maximum typical currents drawn by the corresponding RF or Taco blocks in use and are therefore dependent on the phone s operating mode and state TDMA1900 1930 05 1989 TDMA1900 1850 01 1909 Rx IF BaseBand Rx IF F 2 PLL PLL F 2 PLL F 2 UHF TDMA800 2009 ...

Page 43: ... IF 38 36 mA VCC_CP VCC_TXMIX VCC_TX Pwr Det 1G TX mixer 60 mA 1 mA REF_in REF_out VCC_REF 0 9 mA VCTCXO 1 mA biasing VCC_RX RX 1st mixer VCC_RX RX IF VCC_RX 0 5 mA 6 0 mA 12 mA LNA LNA_bias VCC_LNA 4 3 5 6 mA PA 800 5 mA 5 mA PA 1900 5 mA RX 1st mixer VCC_PLL UHF PLL VCC_PLL VCC_PLL 4 1 4 7 mA 6 7 5 1 mA 0 10 mA 2G VCO 10 mA REF_in PLLs VCC_DIGI 0 8 mA bias reference VREF 50 uA VBATT 3 1 5 0 V 2G...

Page 44: ...y the system requirements but the interference free operation in the field In this receiver structure linearity lies heavily on mixer design The 2nd order distortion requirements of the mixer are set by the half IF suppression A fully balanced mixer topology is required Additionally the receiver 3rd order IIP tends to depend on active mixer IIP3 linearity due to pretty high LNA gain IF stages incl...

Page 45: ...ensitivity digital mode static ch BER 3 ANALOG MODE sinad 12dB 110 min 116 min 110 min Adjacent channel selectivity digital analog 13 16 13 Alternate channel selectivity digital analog 45 65 45 IMD attentuation selectivity digital analog close spaced 60 120 analog wide spaced 330 660 65 65 70 65 Cascaded NF digital analog 9 5 9 5 9 5 Cascaded IIP 3 digital 120 240 240 480 kHz analog 60 120 kHz ana...

Page 46: ...rrent are switched on the contrary In this operation mode the LNA has good linearity still low noise figure and about 3 dB gain During TX slot LNA is in power down mode which is executed by switching the bias cur rent source to 0 mA Gain relative accuracy in receiving band 2 Gain absolute accuracy in receiving band 4 referenced to the sensitivity level After production alignment Parameter MIN TYP ...

Page 47: ...r gain 6 5 7 5 8 5 dB Mixer NF 9 10 11 dB Mixer IIP3 4 4 5 5 dBm Total Gain 16 0 17 0 18 0 dB Noise Figure 5 0 5 5 6 5 dB 3rd order intercept IIP3 4 5 6 dB see Taco spec measurements 70 68 dBc Parameter Minimum Typical Nominal Maximum Unit Notes Total Power up time 0 1 ms Noise figure total 9 5 dB 3rd order input intercept point 25 dBm Max voltage gain Mixer 2nd IF IF 2nd AGC max 78 5 dB Min volta...

Page 48: ...p filter and resonator The output of RX VHF PLL is used as LO signal for the second mixer in receiver TX VHF Synthesizer includes integrated PLL loop filter and resonator The output of TX VHF PLL is used as a LO signal for the IQ modulator of the transmitter See depicted block diagrams and synthesizer characteristics from synthesizer Conversion gain RI 1kohm 23 5 24 24 5 dB IF AGC gain range 5x6 d...

Page 49: ...ver about 6dBm linear output power Note that in this point term linear means 33dB ACP The required LO power is about 6dBm The LO signal is fed from Taco Before power amplifier RF signal is filter in band filter The typical insertion loss is about 2 7dB and maximum less than 3 5dB Input and output return losses are about 10dB Power amplifier is 50Ω 50Ω module It does not have own enable disable con...

Page 50: ...ermal shutdown when radio board s temperature exceeds 85 C False TX indication is based on detected power measurement when carrier is not on The insertion loss of coupler is 0 42dB max at cellular band and 0 48dB max at PCS band Typical values for insertion losses are about 0 2dB The filtering performance of diplexer is taken in account in system calculations Antenna Circuit Here the antenna circu...

Page 51: ... This antenna has a com mon feeding point for both antenna radiators which results in the need for a diplexer In a single band transceiver an SMD compatible through chip can be used Power Level PGA Pout TDMA800 TDM1900 AMPS 2 3 27 3 27 3 24 8 3 4 23 3 23 3 21 6 4 5 19 3 19 3 18 5 5 6 15 3 15 3 14 5 6 7 11 3 11 3 10 5 7 8 7 3 7 3 6 5 8 9 3 3 3 3 9 10 0 7 0 7 10 11 4 7 4 7 ...

Page 52: ...RH 41 System Module CCS Technical Documentation Page 52 Nokia Corporation Confidential Issue 2 09 2003 ...

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