Copyright © 2017 NEXCOM International Co., Ltd. All Rights Reserved.
2
NDiS B537 Series User Manual
Chapter 1: Product Introduction
Hardware Specifications
CPU Support
▪
7th Gen Intel
®
Core
TM
Processor (Socket type CPU up to 35W)
Chipset
▪
Intel
®
PCH H110 (NDiS B537)
▪
Intel
®
PCH Q170 (NDiS B537-I)
Graphics
▪
Intel
®
HD Graphics 500 series
Main Memory
▪
2x 260-pin SO-DIMM sockets, support DDR4 1866/2133 MHz Non ECC,
Un-buffered memory up to 32G (Single Socket Max. 16GB)
I/O Interface-Front
▪
1x Power Button with LED
▪
1x Power LED/ HDD LED
▪
2x USB 3.0
▪
1x HDMI 2.0, 1 x HDMI 1.4
▪
1x DisplayPort (NDiS B537-I only)
▪
1x RJ45 with LEDs for Gigabit LAN (2 x RJ45 for NDiS B537-I only)
▪
2x COM Port
▪
1x 4pin Mini-Din with Lock
I/O Interface-Rear
▪
2x USB 3.0
▪
3x Antenna Holes
▪
1x Mic-in
▪
1x Line-out
Storage
▪
1x 2.5” HDD/SSD
Dimensions
▪
295mm (W) x 189.9mm (D) x 33mm (H), w/o mounting bracket
Construction
▪
Top cover made by aluminum for main heat exchange
Power Supply
▪
1x External 96W AC/DC power adapter
Input: 100VAC to 240VAC
Output: DC+12VDC
API
▪
NEXCOM Xcare
Expansion
▪
1x Mini-PCIe Slot (Full Size)
▪
1x NGFF (M.2) 2230 for Optional WLAN
▪
1x SIM Slot
Environment
▪
Operating Temperature: -10°C to 45°C
▪
Storage Temperature: -20°C to 80°C
▪
Humidity: 10 to 90% (Non-condensing)
Certifications
▪
CE approval
▪
FCC Class B
Operating System
▪
Windows 10/Linux