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SOFTWARE
Temperature Sensor Data
The time vectors for amplifier, auxiliary input, and supply voltage channels are contained in the variables
t_amplifier, t_aux_input,
and
t_supply_
voltage,
respectively. Corresponding waveform data are stored in the arrays
amplifier_data, aux_input_data,
and
supply_voltage_data.
The data structure
amplifier_channels
contains information on each amplifier channel whose data is contained in
amplifier_data.
The structures
aux_
input_channels
and
supply_voltage_channels
contain similar information for other waveforms. The
spike_trigger
data structure contains threshold
levels set in the Spike Scope. (This is provided for informational purposes only; the spike triggers do not influence how waveform data is saved. Howev-
er, spike trigger information could potentially be used in a later post-processing step to compress waveform data.)
The
frequency_parameters
structure contains information on amplifier bandwidth and sampling rates. The
notes
structure contains text notes entered
in the “Configure” tab.
In this example, no ADC channels or digital input channels were enabled when the data file was saved. If those waveforms had been present, additional
MATLAB variables would have been created containing this data as well.
Note that this MATLAB m-file supports the “Traditional Intan File Format”, as well as the informational header files for the other two saved data formats.
Information on reading waveform data from these other file formats may be found in the document RHD2000 Application note: Data file formats, avail-
able from the Intan Technologies website.
Temperature sensor readings from all attached SmartProbes
™
or SmartLink
™
headstages may be saved to disk if the “Traditional Intan File Format”
is selected and the temperature sensor check box is selected (see FIG. 30 on page 17). Temperature data (in degrees Celsius) is stored in the array
temp_sensor_data
. The time vector for temperature sensor data is contained in
t_temp_sensor
. Note that temperature sensor readings may vary up to
±2°C from chip to chip. If precise temperature measurements are required, each chip should be calibrated at a known temperature. Also note that the
temperature sensor reports die temperature, which may be higher than ambient temperature due to power dissipation on the chips and the thermally
insulating nature of the SmartProbe
™
packaging or SmartLink
™
headstages.
p.25