Neo_M680 GPRS Module Hardware User Guide
Copyright © Neoway Technology Co., Ltd
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6 Mounting the Module onto the Application Board
M680 is compatible with industrial standard reflow profile for lead-free SMT process.
The reflow profile is process dependent, so the following recommendation is just a start point guideline:
Only one flow is supported.
Quality of the solder joint depends on the solder volume. Minimum of 0.15mm stencil thickness is
recommended.
Use bigger aperture size of the stencil than actual pad size.
Use a low-residue, no-clean type solder paste.
7 Package
M680 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules
again in case of opening for any reasons.
If exposed in air for more than 48 hours at conditions not worse than 30°C/60% RH, a baking procedure
should be done before SMT. Or, if the indication card shows humidity greater than 20%, the baking
procedure is also required.
The baking should last for at least 12 hours at 90
℃
.
