G6
Hardware User Guide
Copyright © Neoway Technology Co., Ltd
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7.2 Application Foot Print
Figure 7-2 Recommended PCB foot print (Unit: mm)
7.3 Stencil
The recommended stencil thickness is at least 0.12 mm to 0.15 mm.
7.4 Solder Paste
The quality of the solder joint depends on the solder paste volume and the PCB flatness. Do not use
the kind of solder paste different from our module technique.
The melting temperature of solder paste with lead is 35 °C lower than that of solder paste
without lead. It is easy to cause voiding for LCC inside G6 after second reflow soldering.
When using only solder pastes with lead, please ensure that the reflow temperature is kept at
220 °C for more than 45 seconds and the peak temperature reaches 240 °C.