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example, the automatic trigger of 38°C (100°F) allows the thermometer to start
working as soon as the PCB is put on the conveyor chain and into the furnace, so
that the thermocouple will not be triggered by mistake when it is handled by the
human.
Once the initial temperature profile is generated, it can be compared with the
profile recommended by the solder paste manufacturer or the profile shown in
Figure 2.
First, it must be verified that the total time from the ambient temperature to the
peak temperature of the reflux is compatible with the desired stay time of the
heating curve. If it is too long, increase the conveyor speed proportionally; if it is
too short, decrease the conveyor speed proportionally.
In the next step, the shape of the temperature profile must be compared with the
desired one (Figure 2). If the shape is not compatible, then compare it with the
following figures (Figures 3-6). Choose the most compatible temperature profile
compared to the actual shape of the profile. Should consider the deviation from left
to right (process sequence). For example, if there is a difference between the
preheating and soldering zones, first adjust the difference in the preheating zone
correctly. Generally, it is best to adjust one parameter at a time and test in run
before making further adjustments.Because a change in a given zone will also
affect the results of subsequent zones. We also recommend that novices had better
make small adjustments. Once you gain experience on a particular oven, you will
have a better "feel" to make more big adjustments.
Figure 3:Preheat too much/little soldering profile
Summary of Contents for IN12
Page 6: ...5 3 Main Parts 3 1 Reflow Oven Main Body 3 2 Operating Panel...
Page 7: ...6 3 3 Cover and Heating Zone 3 31 Heating Zone...
Page 18: ...17 Figure 4 Set too high low temperature of active zone Figure 5 Soldering too much little...
Page 24: ...23 Regularly add high temperature lubricating oil to transfer chain bearings...
