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SyChip/Murata Confidential Page 22 of 31 SN2100 Datasheet Ver. 1.1

7 Software

7.1 Software

Architecture

SN2100 module communicates with host processor via HCI interface. The HCI interface
transports commands, events, ACL, and synchronous data between the device and the
host using HCI data packets.

The Bluetooth profile stack beyond HCI layer is required to be supported from host
processor.

7.2 Bluetooth Profile Stacks

The table below lists the available Bluetooth Profiles and the sources.

Table 8 Bluetooth Stack Availability

Profiles

Source

Platform

SPP, A2DP
and others

Stonestreet One

TI MSP430, TI Stellaris

«
...
20
21
22
23
24
...
»

Summary of Contents for SN2100

Page 1: ... any time and without notice The information furnished in this data sheet is believed to be accurate and reliable However no responsibility is assumed by SyChip for its use nor any infringements of patents or other rights of third parties resulting from its use No license is generated under any rights of SyChip or its supporters unless specifically agreed ...

Page 2: ...diagram BT IC product number Update the SyChip Part Number 0 6 Jan 05 2012 Viet H Update the spec table 0 61 Jan 31 2012 Y Fang Added disclaimer 0 62 Apr 10 2012 JAG Added packaging labeling and regulatory information 0 63 May 22 2012 Viet H Update the spec table 1 0 Aug 10 2012 Y Fang Added Software and Development Tool sections 1 1 Jun 25 2013 Y Fang Added Recommended host customer circuit board...

Page 3: ...ARACTERISTICS RX 16 5 ENVIRONMENTAL SPECIFICATIONS 17 5 1 ABSOLUTE MAXIMUM RATINGS 17 5 2 OPERATION CONDITIONS 17 6 APPLICATION INFORMATION 18 6 1 RECOMMENDED HOST CUSTOMER CIRCUIT BOARD PCB PATTERN 18 6 2 HOST PCB LAYOUT RECOMMENDATIONS 18 6 3 MODULE LOCATION 19 6 3 1 Location in x y plane 19 6 3 2 Location in z plane 21 7 SOFTWARE 22 7 1 SOFTWARE ARCHITECTURE 22 7 2 BLUETOOTH PROFILE STACKS 22 8...

Page 4: ...al Page 4 of 31 SN2100 Datasheet Ver 1 1 13 3 RF EXPOSURE 27 13 4 IC NOTICE CANADA 27 13 5 IC LABELING REQUIREMENTS 28 13 6 CE NOTICE EUROPE 28 13 7 CE LABELING REQUIREMENTS 28 14 TECHNICAL SUPPORT CONTACT 29 15 DISCLAIMER 29 ...

Page 5: ... IN XY PLANE 20 FIGURE 9 RECOMMENDED LOCATIONS IN Z PLANE 21 FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY PLANE 21 FIGURE 11 REFLOW PROFILE PATTERN 24 FIGURE 12 CARRIER TAPE DIMENSIONS 25 FIGURE 13 MODULE MARKING DETAIL 25 LIST OF TABLES TABLE 1 MODULE CONNECTOR SIGNAL DESCRIPTION 11 TABLE 2 TYPICAL POWER CONSUMPTION 13 TABLE 3 DIGITAL IO SPECIFICATION 13 TABLE 4 RF SPECIFICATIONS 14 TABLE 5 RF SPECI...

Page 6: ...is significantly better than most of the Bluetooth modules do in the market This makes it a good fit for industrial control application that usually requires longer distance coverage The module offers extended product life and industrial standard operating temperature range to fit the industrial usage The SN2100 offers standard HCI interface to the host CPU 1 2 Module Summary Bluetooth V2 0 Power ...

Page 7: ...SyChip Murata Confidential Page 7 of 31 SN2100 Datasheet Ver 1 1 1 3 Block Diagram Figure 1 SN2100 Module Block Diagram ...

Page 8: ...SN2100 Datasheet Ver 1 1 2 Mechanical Specifications 2 1 Module Dimension Parameter Typical Unit Dimension LxWxH 17 5 x 16 0 x 2 0 mm Dimension tolerances LxWxH 0 2 mm mm 2 2 Module top and side view UNIT mm Figure 2 Module Top and Side View ...

Page 9: ...SyChip Murata Confidential Page 9 of 31 SN2100 Datasheet Ver 1 1 2 3 Module bottom view Figure 3 Module Bottom View ...

Page 10: ...SyChip Murata Confidential Page 10 of 31 SN2100 Datasheet Ver 1 1 2 4 Detailed mechanical data top view Figure 4 Detailed Mechanical Data top view ...

Page 11: ...HCI_TX O HCI UART data transmit 6 HCI_RTS O HCI UART Request To Send Host is allowed to send data when RTS is low 7 HCI_RX I HCI UART data receive 8 nRESET I Shutdown input Active Low 9 GND Ground 10 AUD_IN I PCM Data Input 11 AUD_OUT O PCM Data Output 12 AUD_CLK I O PCM Clock 13 AUD_SYNC I O PCM Frame Sync 14 GND Ground 15 GND Ground 16 GND Ground 17 GND Ground 18 GND Ground 19 GND Ground 20 GND ...

Page 12: ...SyChip Murata Confidential Page 12 of 31 SN2100 Datasheet Ver 1 1 Pin Pin name I O Description 29 GND Ground 30 GND Ground 31 GND Ground 32 GND Ground ...

Page 13: ...current VIN 3 0V TEMP 25 C 165 mA RX maximum current VIN 3 0V TEMP 25 C 50 mA 3 2 Digital IO Specification VIN 3 0V TEMP 25 C unless otherwise stated Table 3 Digital IO Specification Item Condition Symbol Min Max UNIT High Level Input Voltage VIH 0 65 x VDD VDD V Low Level Input Voltage VIL 0 0 35 x VDD V High Level Output Voltage At 2 4 8 mA VOH 0 8 x VDD VDD V At 0 1 mA VDD 0 2 VDD V Low Level o...

Page 14: ...ncy range RX TX 2402 2480 MHz 20 dB bandwidth 0 928 1 MHz Adjacent Channel Power M N 2 40 20 dBm M N 3 43 40 dBm Modulation Characteristics Modulation delta f1 avg 159 140 175 kHz Modulation delta f2 max 136 115 kHz Modulation delta f2 avg delta f1 avg 0 9 0 8 Initial Carrier Frequency Tolerance 2 75 75 kHz Carrier Frequency Drift 1 slot 25 2 25 25 kHz 3 slot 40 1 40 40 kHz 5 slot 40 1 40 40 kHz M...

Page 15: ...SyChip Murata Confidential Page 15 of 31 SN2100 Datasheet Ver 1 1 1 EIRP ...

Page 16: ...Spec Units Sensitivity BER 0 1 92 70 dBm C I Performance BER 0 1 Co channel ratio 60 dBm input 10 11 dB 1MHz ratio 60dBm input 7 0 dB 2MHz ratio 60dBm input 21 30 dB 3MHz ratio 67dBm input 44 40 dB Blocking Performance BER 0 1 30MHz 2000MHz 5 10 dBm 2000MHz 2400MHz 5 27 dBm 2500MHz 3000MHz 5 27 dBm 3000MHz 12750MHz 5 10 dBm Intermodulation Performance BER 0 1 64 dBm input 36 39 dBm Maximum Input L...

Page 17: ...escription Min Max Units Top Operating temperature 40 85 C Tst Storage temperature 40 85 C VIN Power supply 0 3 5 0 V MSL Moisture Sensitivity Level 3 RoHS Restriction of Hazardous Substances Compliant 5 2 Operation conditions Table 7 Recommended Operating Conditions Symbol Parameter Min Typ Max Units VIN Power supply 2 2 3 0 3 3 V Top Operating temperature 40 85 C ...

Page 18: ...er circuit board PCB pattern Figure 5 Recommended Host customer PCB Pattern 6 2 Host PCB layout recommendations The SN3020 module has an onboard antenna therefore it requires some special host PCB layout underneath the module such that the radio can achieve its best RF performance Refer to Figure 6 for the requirements ...

Page 19: ...ayers of the customer circuit board should be free of any metal objects Specifically there should be no ground plane traces or metal shield case 2 The area in Zone2 on the top layer of the customer circuit board should have ground only with no signal traces 6 3 Module Location For optimum EIRP customer is advised to use the recommended module location on their respective PCB 6 3 1Location in x y p...

Page 20: ...ta Confidential Page 20 of 31 SN2100 Datasheet Ver 1 1 Antenna Connector Antenna Shield Case No GND in this area See Fig 8 Figure 7 Recommended Locations in xy plane Figure 8 Locations Not Recommended in xy plane ...

Page 21: ...age 21 of 31 SN2100 Datasheet Ver 1 1 6 3 2 Location in z plane Antenna Connector Antenna Metal Module Mother Board Metal Figure 9 Recommended Locations in z plane Metal Metal Metal Figure 10 Locations Not Recommended in xy plane ...

Page 22: ...nds events ACL and synchronous data between the device and the host using HCI data packets The Bluetooth profile stack beyond HCI layer is required to be supported from host processor 7 2 Bluetooth Profile Stacks The table below lists the available Bluetooth Profiles and the sources Table 8 Bluetooth Stack Availability Profiles Source Platform SPP A2DP and others Stonestreet One TI MSP430 TI Stell...

Page 23: ...and Stellaris platform The table below lists the related tools that the customer may need Table 9 Development Tools Tool Description Online Resources 1 88 00150 85 SN2100 EM Development Kit http www murata ws com 2100 htm 2 TI MSP EXP430F5438 MSP430 Experimenter Board http www ti com tool msp exp430f5438 3 TI MSP FET430UIF MSP430 USB Debugging Interface http www ti com tool msp fet430uif ...

Page 24: ... to its host PCB The module is designed to withstand 2 reflows Opposite side reflow is prohibited due to the module weight Table 10 Reflow Profile Recommendation Ramp up rate 3o C second max Maximum time maintained above 217o C 120 seconds Peak temperature 250o C Maximum time within 5o C of peak temperature 20 seconds Ramp down rate 6o C second max Reflow Profile 0 50 100 150 200 250 Time seconds ...

Page 25: ...gure 12 Carrier Tape Dimensions 10 2 Module Marking Information The following marking information may be printed on a permanent label affixed to the module shield or permanently laser written into the module shield itself The 2D barcode is used for internal purposes A pin 1 ID is stamped into the shield Figure 13 Module Marking Detail ...

Page 26: ...nformation SN2100 has obtained the certifications described below 13 1 FCC Notice USA This device using the integrated antenna has been tested to comply with FCC CFR Part 15 The device meets the requirements for modular transmitter approval as detailed in the FCC public notice DA00 1407 Operation is subject to the following two conditions 1 this device may not cause harmful interference and 2 this...

Page 27: ...oduct the FCC labeling requirements must be met by the OEM This includes placing a clearly visible label on the outside of the finished product specifying the SN2100 FCC identifier FCC ID QPU2100 as well as the underlined FCC Notice above The exterior label can use wording such as Contains Transmitter Module FCC ID QPU2100 or Contains FCC ID QPU2100 although any similar wording that expresses the ...

Page 28: ...nt être obtenues http www hc sc gc ca ewh semt pubs radiation radio_guide lignes_direct eng php 13 5 IC Labeling Requirements The host device should be properly labeled to identify the module within the host device The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device otherwise the host device must be labeled to display the Indu...

Page 29: ... such products which are caused under the conditions other than those specified in this specification SYCHIP HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS EXPRESS OR IMPLIED INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE THAT THEY ARE DEFECT FREE OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS YOU AGREE TO INDEMNIFY AND DEFEND SYCHIP AND ITS AF...

Page 30: ...ent any damages that may be caused by the abnormal function or the failure of our product Notwithstanding the foregoing the product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party s life body or property Aircraft equipment Aerospace equipment Undersea equipment Power plant...

Page 31: ...r for any products that have been altered or modified in any way by an entity other than SyChip Moreover SyChip shall not be liable for any defects that result from your or third party s design specifications or instructions for such products 4 Testing and other quality control techniques are used to the extent SyChip deems necessary Unless mandated by government requirements SyChip does not neces...

Page 32: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Murata 88 00150 85 ...

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