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No

Item

Test  Method

1 Operating

2C,5C : -55

 to 125

Temperature Range

2 Rated Voltage

See the previous pages.

 The rated voltage is defined as the maximum voltage which may  be 

 applied continuously to the capacitor.

 When AC voltage is superimposed on DC voltage, V

P-P

 or  V

O-P

,

 whichever is larger, should be maintained within the rated 

  voltage range.

3 Appearance

No defects or abnormalities.

Visual inspection.

4 Dimension

Within the specified dimensions.

Using calipers. 

5 Dielectric Strength

No defects or abnormalities.

No failure should be observed when 250% of the rated

voltage  is applied between the terminations for 1 to 5

seconds, provided the charge/discharge current is less

than 50mA.

6 Insulation 

More than 10,000M

Ω

The insulation resistance should be measured with a DC

      Resistance

voltage not exceeding the rated voltage at 20

/25

and 75%RH max. and within 2 minutes of charging.

7 Capacitance

Within the specified tolerance. 

The capacitance/Q should be measured at 20

/25

at the frequency and voltage shown in the table.

8 Q

30pFmin. : Q

1400

30pFmax.: Q

800+20C

C:NominalCapacitance (pF) 

9

Capacitance

Capacitance Within the specified tolerance.(Table A-1)

The temperature coefficient is determind using the

Temperature

Change

capacitance measured in step 3 as a reference.

Characteristics

When cycling the temperature sequentially from step 1 

through 5 the capacitance should be within the specified

 

tolerance for the temperature coefficient and capacitance 

Temperature Within the specified tolerance.(Table A-1)

change as Table A-1.

Coefficent

The capacitance drift is caluculated by dividing the 

differences betweeen the maximum and minimum measured

values in the step 1,3 and 5 by the cap. value in step 3.

Capacitance Within 

±

0.2% or 

±

0.05pF

Drift

(Whichever is larger.)

10 Adhesive Strength of 

No removal of the terminations or other defect should occur. 

Solder the capacitor on the test jig (glass epoxy

Termination

board)shown in Fig.3 using an eutectic solder. Then apply

10N* force in parallel with the test jig for 10+/-1sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

*5N

GQM18)

11 Vibration 

Appearance No defects or abnormalities.

Solder the capacitor on the test jig (glass epoxy board) in the

Resistance

same manner and under the same conditions as (10). 

Capacitance Within the specified tolerance.

The capacitor should be subjected to a simple harmonic

motion having a total amplitude of 1.5mm, the frequency

Q

30pFmin. : Q

1400

being varied uniformly between the approximate limits of 10

30pFmax.: Q

800+20C

and 55Hz. The frequency range, from 10 to 55Hz and return

to 10Hz, should be traversed in approximately 1 minute. This

C:NominalCapacitance (pF)

motion should be applied for a period of 2 hours in each 3

 

 

mutually perpendicular directions(total of 6 hours).

12 Deflection

Appearance No marking defects.

Solder the capacitor on the test jig (glass epoxy board)

shown in Fig.1 using an eutectic solder. Then apply a force

Capacitance Within 

±

5

 or 

±

0.5pF

in the direction shown in Fig 2. The soldering

Change

(Whichever is larger)

should be done by the reflow method and should be

conducted with care so that the soldering is uniform and free

of defects such as heat shock.

13 Solderability

75% of the terminations is to be soldered evenly 

Immerse the capacitor in a solution of ethanol (JIS-K-8101)

        of Termination

and continuously.

and rosin (JIS-K-5902) (25% rosin in weight propotion) .

Preheat at 80 to 120

  for 10 to 30 seconds.

After preheating, immerse in an eutectic solder solution for 

2+/-0.5 seconds at 230+/-5

 or Sn-3.0Ag-0.5Cu solder

solution for 2+/-0.5 seconds at 245+/-5

SPECIFICATIONS AND TEST METHODS

Specification

 

 

 

Char. 

Item 

Δ

(1000pF and below) 

Frequency 

1

0.1MHz 

Voltage 

0.5 to 5Vrms 

 

  

Step 

Temperature(

C) 

20

2 / 25

-55

20

2 / 25

125

20

2 / 25

JEMCNS-0022C

2

Summary of Contents for GQM1875C2E270FB12 Series

Page 1: ...tance Tolerance 250 Vdc 27 pF Temp Range Ref Temp 8 Packaging 1 2 W 0 8 0 15 e 1 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test M...

Page 2: ...r Solder the capacitor on the test jig glass epoxy Termination board shown in Fig 3 using an eutectic solder Then apply 10N force in parallel with the test jig for 10 1sec The soldering should be done...

Page 3: ...5 5C 2 C Nominal Capacitance pF I R More than 1 000M 17 Humidity Load The measured and observed characteristics shall satisfy Apply the rated voltage at 40 2 and 90 to 95 humidity the specifications i...

Page 4: ...part of Fig 1 Solder resist Coat with heat resistant resin for solder Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS AND TEST METHODS 2 4 0 0 1 8 0 0 3 3 5 0 05 0 05 1 1 5 0 1 0 t 1 2 2 0 0 05 1 7...

Page 5: ...e K GQM18 4000 10000 GQM2 4000 10000 GQM2 1000 4000 1 2 Dimensions of Tape 1 GQM18 21 in mm Code GQM18 GQM21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 2 GQM22 Code GQM22 A 2 8 B 3 5 Nominal Value PACKA...

Page 6: ...Hole As specified in 1 2 Hole for Chip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence 180 0 3 0 330 2 0 50 min 13 0 5 2 0 0 5 Chip in mm Fig...

Page 7: ...om tape 1 9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dim...

Page 8: ...ight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wi...

Page 9: ...ntended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measureme...

Page 10: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 11: ...perature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors cha...

Page 12: ...inted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting positio...

Page 13: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 14: ...Time Recommended Conditions Pb Sn Solder Lead Free Solder Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3...

Page 15: ...nd Time be sure to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to GQM22 Series Table 2 GQM18 21 31 T 150...

Page 16: ...Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GQM18 the top of the solder fillet should be lower...

Page 17: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 18: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Page 19: ...thers 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsene...

Page 20: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 21: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 22: ...m the suitable land dimension by evaluating of the actual SET PCB Table 1 Flow Soldering Method Dimensions Part Number in mm Table 2 Reflow Soldering Method Dimensions Part Number in mm Notice Chip L...

Page 23: ...absorption Control curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a dete...

Page 24: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 25: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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