Temperature
Compensating Type
High Dielectric Type
18 Board Flex
Appearance
No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5
±
1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
Capacitance
Within ±5.0% or ±0.5pF
R7/L8/R9: Within ±10.0%
soldering is uniform and free of defects such as heat shock.
Change
(Whichever is larger)
Q/D.F.
30pFmin. : Q
≧
1000
R7/L8 : W.V.: 25Vmin.: 0.025 max.
30pFmax.: Q
≧
400+20C
W.V.: 16V/10V : 0.035max.
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R.
More than 10,000M
Ω or 500Ω
・
F
(Whichever is smaller)
19 Terminal
Appearance
No marking defects
Solder the capacitor to the test jig (glass epoxy board) shown in
Strength
Fig.3 using a eutectic solder. Then apply *18N force in parallel with
Capacitance
Within specified tolerance
the test jig for 60sec.
Change
The soldering should be done either with an iron or using the reflow
Q/D.F.
30pFmin. : Q
≧
1000
R7/L8 : W.V.: 25Vmin.: 0.025 max.
method and should be conducted with care so that the soldering is
30pFmax.: Q
≧
400+20C
W.V.: 16V/10V : 0.035max.
uniform and gree of defects such as heat shock
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R.
More than 10,000M
Ω or 500Ω
・
F
(Whichever is smaller)
（
in mm
）
20 Beam Load Test
Destruction value should be exceed following one.
Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. >
Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm max. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : *0.5mm / sec.
*GCM03: 0.1mm/sec.
Chip thickness < 1.25mm rank : 15N
Chip thickness
≧
1.25mm rank : 54.5N
Chip thickness > 0.5mm rank : 20N
Chip thickness
≦
0.5mm rank : 8N
■
AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
t : 1.6mm
Fig.3
Fig.4
*2N(GCM03/15)
(GCM03/15:0.8mm
Type
a
b
c
GCM03
0.3
0.9
0.3
GCM15
0.5
1.5
0.6
GCM18
0.6
2.2
0.9
GCM21
0.8
3.0
1.3
GCM31
2.0
4.4
1.7
GCM32
2.0
4.4
2.6
(in mm)
＊2
4.0±0.1
8.
0±
0.
3
3.5
±
0.
05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
100
40
a
c
b
f
4.5
c
Fig.1
Type
a
b
c
GCM03
0.3
0.9
0.3
GCM15
0.4
1.5
0.5
GCM18
1.0
3.0
1.2
GCM21
1.2
4.0
1.65
GCM31
2.2
5.0
2.0
GCM32
2.2
5.0
2.9
＊2
4.0±0.1
8
.0
±
0.
3
3.5
±
0
.0
5
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f
4.5
c
Solder resist
Baked electrode or
Copper foil
b
t: 1.6mm
(GCM03/15: 0.8mm)
Iron Board
45
45
Flexure：≦2
(High Dielectric Type)
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
Flexure：≦3
(Temperature
Compensating Type)
R4
20
114
L
0.6L
JEMCGS-0363S
5
